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Name: 10AX027E4F27E3SG
Brand: Intel
SKU: 10AX027E4F27E3SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX027E4F27E3SG

Part No.:: 10AX027E4F27E3SG

Manufacturer:: Intel

Package:: 672-BBGA, FCBGA

Datasheet:: 10AX027E4F27E3SG.pdf

Description:: IC FPGA 240 I/O 672FBGA

In Stock:: 3708

Quantity:: Add To Cart

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10AX027E4F27E3SG Specifications

Package/Case:
672-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
101620
NumberofLogicElements/Cells:
270000
TotalRAMBits:
17870848
NumberofI/O:
240
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX027E4F27E3SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX027E4F27E3SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX027E4F27E3SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX027E4F27E3SG information

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10AX027E4F27E3SG Application Introduction

10AX027E4F27E3SG is a field-programmable gate array (FPGA) chip known for its versatility and high-performance capabilities, widely used in various electronic design projects for signal processing, data encryption, and digital communication applications.

Application Scenario:

In a digital communication system, 10AX027E4F27E3SG can be utilized for implementing complex modulation/demodulation algorithms, error correction coding, and protocol handling tasks.

Circuit Design:

To effectively utilize 10AX027E4F27E3SG in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management techniques to ensure stable voltage levels and minimize power consumption of 10AX027E4F27E3SG and associated components. Utilize low-dropout voltage regulators and power gating techniques to optimize power efficiency.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal integrity issues such as signal crosstalk, reflection, and noise interference. Use proper impedance matching techniques, ground/power plane separation, and signal routing guidelines to maintain signal integrity and maximize performance.

3. Thermal Management:

Ensure effective thermal management by incorporating heatsinks, thermal vias, and proper airflow in the system design to dissipate heat generated by 10AX027E4F27E3SG and prevent overheating. Perform thermal analysis to identify hotspots and optimize component placement for efficient heat dissipation.

4. Clock Distribution:

Design a robust clock distribution network to provide stable and synchronized clock signals to 10AX027E4F27E3SG and peripheral components. Minimize clock skew and jitter by using low-phase noise oscillators, proper termination techniques, and clock tree synthesis optimization.

5. Design for Testability:

Incorporate built-in self-test (BIST) features and debug interfaces in the design to facilitate functional testing, diagnosis, and debugging of 10AX027E4F27E3SG during development and production phases. Implement boundary scan (JTAG) or IEEE 1149.1 standard for comprehensive testing coverage.

Considerations:

When designing with 10AX027E4F27E3SG, it's crucial to consider:

- Resource Utilization: Optimize FPGA resource utilization by efficiently mapping design logic onto FPGA fabric and minimizing resource wastage.

- Timing Closure: Perform timing analysis and optimization to ensure all timing constraints are met, and the design operates at the desired clock frequency without violating setup and hold time requirements.

- Design Security: Implement security measures such as bitstream encryption, IP protection, and secure boot mechanisms to safeguard intellectual property and prevent unauthorized access to the FPGA design.

- Design for Reliability: Conduct thorough validation and verification testing to ensure the reliability, robustness, and functional correctness of the 10AX027E4F27E3SG-based system under various operating conditions and stress scenarios.

10AX027E4F27E3SG FAQ

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3. Are the 10AX027E4F27E3SG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX027E4F27E3SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX027E4F27E3SG we delivered, we will accept the replacement or return of the 10AX027E4F27E3SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX027E4F27E3SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations