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Name: 10AX027E4F27E3LG
Brand: Intel
SKU: 10AX027E4F27E3LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX027E4F27E3LG

Part No.:: 10AX027E4F27E3LG

Manufacturer:: Intel

Package:: 672-BBGA, FCBGA

Datasheet:: 10AX027E4F27E3LG.pdf

Description:: IC FPGA 240 I/O 672FBGA

In Stock:: 3045

Quantity:: Add To Cart

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10AX027E4F27E3LG Specifications

Package/Case:
672-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
101620
NumberofLogicElements/Cells:
270000
TotalRAMBits:
17870848
NumberofI/O:
240
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX027E4F27E3LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX027E4F27E3LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX027E4F27E3LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX027E4F27E3LG information

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10AX027E4F27E3LG Application Introduction

10AX027E4F27E3LG is a field-programmable gate array (FPGA) device manufactured by Intel, offering high performance and flexibility for a wide range of applications.

Application Scenario:

In telecommunications infrastructure, 10AX027E4F27E3LG can be utilized for signal processing tasks, such as baseband processing in wireless communication systems.

Circuit Design:

To effectively utilize 10AX027E4F27E3LG in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply schemes to ensure stable voltage levels and minimize power consumption of 10AX027E4F27E3LG and associated components. Utilize low-dropout regulators and power gating techniques to optimize power usage.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal reflections, crosstalk, and impedance mismatches. Use proper termination techniques, controlled impedance traces, and signal integrity analysis tools to ensure reliable high-speed signal transmission within the 10AX027E4F27E3LG device.

3. Thermal Management:

Ensure adequate heat dissipation for 10AX027E4F27E3LG to prevent overheating and maintain optimal operating temperature. Utilize thermal vias, heatsinks, or thermal simulation tools to manage heat effectively and enhance device reliability.

4. Clock Distribution:

Optimize clock distribution networks to minimize clock skew and jitter within the FPGA device. Use dedicated clock routing resources, such as clock trees and PLLs, to ensure precise timing synchronization for synchronous logic operations.

5. I/O Optimization:

Maximize I/O utilization by carefully planning pin assignments and implementing I/O multiplexing techniques. Utilize differential signaling and LVDS standards for high-speed serial communication interfaces to achieve robust data transmission with 10AX027E4F27E3LG.

Considerations:

When designing with 10AX027E4F27E3LG, it's essential to consider:

- Resource Utilization: Optimize logic utilization and resource allocation within the FPGA to meet performance and area constraints.

- Timing Closure: Perform thorough timing analysis and constraint optimization to ensure timing closure and meet design performance requirements.

- Design Security: Implement security features, such as device authentication and encryption, to protect the FPGA design from unauthorized access and intellectual property theft.

- Design Validation: Conduct comprehensive functional and timing simulations, as well as hardware testing, to validate the design functionality and performance before deployment.

- Design Reusability: Design modular and scalable FPGA architectures to facilitate design reuse and adaptation for future projects or product variants.

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3. Are the 10AX027E4F27E3LG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX027E4F27E3LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX027E4F27E3LG we delivered, we will accept the replacement or return of the 10AX027E4F27E3LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX027E4F27E3LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations