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Name: 10AX027E3F29E2SG
Brand: Intel
SKU: 10AX027E3F29E2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX027E3F29E2SG

Part No.:: 10AX027E3F29E2SG

Manufacturer:: Intel

Package:: 780-BBGA, FCBGA

Datasheet:: 10AX027E3F29E2SG.pdf

Description:: IC FPGA 360 I/O 780FBGA

In Stock:: 2655

Quantity:: Add To Cart

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10AX027E3F29E2SG Specifications

Package/Case:
780-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
101620
NumberofLogicElements/Cells:
270000
TotalRAMBits:
17870848
NumberofI/O:
360
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX027E3F29E2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX027E3F29E2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX027E3F29E2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX027E3F29E2SG information

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10AX027E3F29E2SG Typical application Circuitry

The 10AX027E3F29E2SG is an Arria 10 FPGA (Field Programmable Gate Array) chip from Intel (formerly Altera). This 10AX027E3F29E2SG chip is designed for high-performance, power-efficient applications in various fields such as data centers, broadcast, networking, and communications.

Key Features of 10AX027E3F29E2SG:

- High-performance FPGA: Provides a large number of logic elements, DSP blocks, and memory for complex digital signal processing and high-speed data processing.

- Integrated transceivers: Supports high-speed serial communication for protocols like PCIe, 10GbE, and others.

- Power efficiency: Optimized for low power consumption while maintaining high performance.

Application Scenario: High-Speed Networking Device

In this scenario, the 10AX027E3F29E2SG FPGA is used in a high-speed networking device for packet processing and routing in a data center.

Circuit Connection Details:

- Power Supply: Connect the VCC and GND pins to a stable power source. Place decoupling capacitors near the power pins to filter out noise.

- Clock Source: Connect an external precision clock source to the dedicated clock input pins to provide a stable clock signal for the FPGA.

- Data Input/Output: Connect high-speed Ethernet PHYs (Physical Layer Devices) to the FPGA's transceiver pins for data input and output. Use differential signaling for improved noise immunity.

- Packet Processing: Utilize the FPGA's logic elements and DSP blocks to perform packet processing tasks such as packet filtering, routing, and forwarding.

- Memory Interface: Connect external memory devices (e.g., DDR4 RAM) to the FPGA's memory interface pins for packet buffering and storage.

- JTAG Interface: Connect the TDI, TDO, TCK, and TMS pins to a JTAG programmer for FPGA configuration and debugging. Ensure that the JTAG chain is properly set up if multiple devices are connected.

Design Considerations:

- Thermal Management: Implement proper cooling solutions to manage the heat generated by the FPGA, especially in high-performance applications.

- Signal Integrity: Pay attention to PCB layout and routing to ensure signal integrity for high-speed signals, minimizing crosstalk and electromagnetic interference.

- Power Supply Noise: Use proper filtering and decoupling techniques to minimize power supply noise, which can affect the performance of the FPGA.

- FPGA Configuration: Ensure that the FPGA configuration memory is correctly connected and programmed to load the FPGA configuration at power-up.

In summary, the 10AX027E3F29E2SG FPGA is a powerful and versatile chip that can be used in a wide range of applications, from networking to data processing. When designing a circuit with this FPGA, it's important to consider factors like power supply, signal integrity, and thermal management to ensure optimal performance.

Packaging and Pinout for 10AX027E3F29E2SG

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6. What is the process for return or replacement of 10AX027E3F29E2SG?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX027E3F29E2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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