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Name: 10AX027E2F29I2SG
Brand: Intel
SKU: 10AX027E2F29I2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX027E2F29I2SG

Part No.:: 10AX027E2F29I2SG

Manufacturer:: Intel

Package:: 780-BBGA, FCBGA

Datasheet:: 10AX027E2F29I2SG.pdf

Description:: IC FPGA 360 I/O 780FBGA

In Stock:: 2406

Quantity:: Add To Cart

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10AX027E2F29I2SG Specifications

Package/Case:
780-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
101620
NumberofLogicElements/Cells:
270000
TotalRAMBits:
17870848
NumberofI/O:
360
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

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10AX027E2F29I2SG information

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10AX027E2F29I2SG Application Introduction

10AX027E2F29I2SG is a field-programmable gate array (FPGA) chip renowned for its versatility and high-performance capabilities, commonly utilized in a myriad of electronic design projects for diverse applications.

Application Scenarios:

In the realm of digital signal processing, 10AX027E2F29I2SG can be harnessed to implement complex algorithms for real-time audio and video processing, such as in multimedia systems and digital audio workstations (DAWs).

Circuit Design:

To effectively leverage 10AX027E2F29I2SG in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure optimal utilization of power resources within the FPGA. Utilize dynamic power management schemes to adjust power consumption based on workload, and employ low-power design strategies during idle states.

2. Signal Integrity:

Ensure robust signal integrity by carefully designing the PCB layout to minimize signal distortion and interference. Utilize proper termination techniques, controlled impedance traces, and adequate ground and power plane distribution to maintain signal integrity across the FPGA's high-speed I/O interfaces.

3. Thermal Management:

Manage heat dissipation effectively to prevent thermal issues and ensure reliable operation of the FPGA. Employ efficient heatsinking solutions, thermal vias, and thermal analysis tools to optimize thermal performance and maintain the FPGA within its specified operating temperature range.

4. Clock Distribution:

Design a robust clock distribution network to ensure synchronous operation and minimize clock skew within the FPGA. Utilize dedicated clock routing resources, clock buffers, and phase-locked loops (PLLs) to distribute clock signals efficiently and minimize timing uncertainties.

5. Design Partitioning:

Partition the design into manageable modules to facilitate design verification, debugging, and scalability. Utilize hierarchical design methodologies and IP core integration to modularize the design, enhance design reuse, and simplify design maintenance and updates.

Considerations:

When optimizing your FPGA design, consider the following factors:

- Resource Utilization: Optimize resource utilization to maximize the efficiency and performance of the FPGA design while minimizing resource conflicts and contention.

- Timing Closure: Perform comprehensive timing analysis and optimization to ensure timing closure and meet the design's timing constraints across all operational modes and corner cases.

- Design Security: Implement appropriate security measures, such as bitstream encryption and design obfuscation, to protect sensitive intellectual property (IP) and prevent unauthorized access or tampering.

- Design Verification: Conduct thorough functional verification and testing to validate the correctness and robustness of the FPGA design under various operating conditions and corner cases.

- Design Documentation: Maintain comprehensive documentation throughout the design process to facilitate design reviews, collaboration, and future revisions.

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3. Are the 10AX027E2F29I2SG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX027E2F29I2SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX027E2F29I2SG we delivered, we will accept the replacement or return of the 10AX027E2F29I2SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX027E2F29I2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations