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Name: 10AX027E2F29E2LG
Brand: Intel
SKU: 10AX027E2F29E2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX027E2F29E2LG

Part No.:: 10AX027E2F29E2LG

Manufacturer:: Intel

Package:: 780-BBGA, FCBGA

Datasheet:: 10AX027E2F29E2LG.pdf

Description:: IC FPGA 360 I/O 780FBGA

In Stock:: 3858

Quantity:: Add To Cart

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10AX027E2F29E2LG Specifications

Package/Case:
780-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
101620
NumberofLogicElements/Cells:
270000
TotalRAMBits:
17870848
NumberofI/O:
360
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX027E2F29E2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX027E2F29E2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX027E2F29E2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX027E2F29E2LG information

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10AX027E2F29E2LG Application Introduction

10AX027E2F29E2LG is a Field-Programmable Gate Array (FPGA) device renowned for its versatility and performance, commonly utilized in a wide range of electronic design projects. It offers high-density logic resources, embedded memory blocks, and flexible connectivity options.

Application Scope:

In digital signal processing applications, 10AX027E2F29E2LG can be leveraged to implement complex algorithms for audio and video processing, communication systems, and image recognition.

Design Optimization:

To effectively utilize 10AX027E2F29E2LG in your project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and ensure reliable operation of 10AX027E2F29E2LG and associated components. Utilize low-power design techniques such as clock gating, power gating, and dynamic voltage and frequency scaling.

2. Signal Integrity:

Ensure proper signal integrity by carefully designing the PCB layout and minimizing signal reflections, crosstalk, and electromagnetic interference. Use impedance matching techniques, differential signaling, and shielding to maintain signal integrity in high-speed interfaces.

3. Thermal Management:

Manage thermal dissipation effectively to prevent overheating and ensure the longevity of 10AX027E2F29E2LG. Utilize thermal vias, heat sinks, and fans to dissipate heat efficiently, especially in high-performance applications or environments with elevated temperatures.

4. Design Partitioning:

Break down the design into smaller, manageable modules to facilitate easier implementation and debugging. Utilize hierarchical design techniques to organize the project into functional blocks, enhancing modularity and scalability.

5. Clock Management:

Implement robust clock distribution networks and utilize advanced clocking features of 10AX027E2F29E2LG to optimize timing constraints and minimize clock skew. Utilize PLLs and DLLs for clock synthesis, phase shifting, and jitter reduction.

Considerations:

When designing with 10AX027E2F29E2LG, it's essential to consider:

- Design Constraints: Understand and adhere to the device's specifications, including maximum operating frequency, resource utilization, and I/O standards.

- Timing Closure: Perform thorough timing analysis and optimization to ensure all timing constraints are met, avoiding timing violations and potential performance bottlenecks.

- Design Verification: Employ rigorous testing methodologies, including simulation, emulation, and hardware-in-the-loop testing, to validate the functionality and performance of the design before deployment.

- Security: Implement security features and protocols to protect the intellectual property (IP) embedded in the design and prevent unauthorized access or tampering.

- Design Documentation: Maintain comprehensive documentation throughout the design process, including schematics, block diagrams, and design specifications, to facilitate collaboration and future maintenance.

10AX027E2F29E2LG FAQ

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3. Are the 10AX027E2F29E2LG price and inventory displayed accurate?

The price and inventory of 10AX027E2F29E2LG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX027E2F29E2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX027E2F29E2LG we delivered, we will accept the replacement or return of the 10AX027E2F29E2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX027E2F29E2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations