What is the Additional Feature ?

Name: 10AX027E2F27I1SG
Brand: Intel
SKU: 10AX027E2F27I1SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX027E2F27I1SG

Part No.:: 10AX027E2F27I1SG

Manufacturer:: Intel

Package:: 672-BBGA, FCBGA

Datasheet:: 10AX027E2F27I1SG.pdf

Description:: IC FPGA 240 I/O 672FBGA

In Stock:: 2433

Quantity:: Add To Cart

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10AX027E2F27I1SG Specifications

Package/Case:
672-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
101620
NumberofLogicElements/Cells:
270000
TotalRAMBits:
17870848
NumberofI/O:
240
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX027E2F27I1SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX027E2F27I1SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX027E2F27I1SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX027E2F27I1SG information

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10AX027E2F27I1SG Application Introduction

10AX027E2F27I1SG is a Field-Programmable Gate Array (FPGA) chip manufactured by Intel, offering high-performance logic and configurable features for diverse applications.

Application Scenario:

In digital signal processing and communication systems, 10AX027E2F27I1SG can be utilized for real-time data processing, protocol implementation, and signal modulation/demodulation tasks.

Circuit Design:

To effectively utilize 10AX027E2F27I1SG in your design, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption and ensure reliable operation of 10AX027E2F27I1SG. Utilize low-dropout voltage regulators and power gating techniques to achieve optimal power efficiency.

2. Signal Integrity:

Ensure proper signal integrity by employing techniques such as impedance matching, signal termination, and controlled impedance routing. Pay special attention to high-speed interfaces and critical signal paths to mitigate signal degradation and ensure robust data transmission.

3. Thermal Management:

Design an effective thermal management solution to dissipate heat generated by 10AX027E2F27I1SG and associated circuitry. Utilize heat sinks, thermal vias, and proper airflow to maintain optimal operating temperatures and prevent thermal-induced performance degradation.

4. Configuration and Programming:

Optimize the FPGA configuration and programming process to streamline development and deployment cycles. Utilize efficient synthesis and optimization techniques to minimize resource utilization and improve design performance.

5. Clock Management:

Implement robust clock management strategies to ensure precise timing and synchronization within the FPGA design. Utilize dedicated clocking resources, such as PLLs and clock networks, to achieve accurate clock generation and distribution across the system.

Considerations:

When designing with 10AX027E2F27I1SG, consider the following factors to optimize overall system performance and reliability:

- Resource Utilization: Efficiently utilize FPGA resources to maximize design flexibility and minimize resource constraints.

- Design Validation: Perform thorough design validation and verification to ensure functional correctness and meet performance requirements.

- Security: Implement security measures, such as bitstream encryption and device authentication, to protect intellectual property and prevent unauthorized access to FPGA configurations.

- System Integration: Integrate 10AX027E2F27I1SG seamlessly into the overall system architecture, considering compatibility with other components and interfaces.

- Future Expansion: Design the FPGA system with scalability in mind, allowing for future upgrades and expansion to accommodate evolving project requirements.

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6. What is the process for return or replacement of 10AX027E2F27I1SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX027E2F27I1SG we delivered, we will accept the replacement or return of the 10AX027E2F27I1SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX027E2F27I1SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations