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Name: 10AX027E1F27I1SG
Brand: Intel
SKU: 10AX027E1F27I1SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX027E1F27I1SG

Part No.:: 10AX027E1F27I1SG

Manufacturer:: Intel

Package:: 672-BBGA, FCBGA

Datasheet:: 10AX027E1F27I1SG.pdf

Description:: IC FPGA 240 I/O 672FBGA

In Stock:: 3332

Quantity:: Add To Cart

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10AX027E1F27I1SG Specifications

Package/Case:
672-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
101620
NumberofLogicElements/Cells:
270000
TotalRAMBits:
17870848
NumberofI/O:
240
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX027E1F27I1SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX027E1F27I1SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX027E1F27I1SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX027E1F27I1SG information

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10AX027E1F27I1SG Application Introduction

10AX027E1F27I1SG is a field-programmable gate array (FPGA) device manufactured by Intel, offering high-performance and flexibility for a wide range of applications in the field of digital design and signal processing.

Application Scenario:

In telecommunications infrastructure, 10AX027E1F27I1SG can be utilized for implementing signal processing algorithms, such as channel encoding and modulation/demodulation schemes, in wireless communication systems.

Circuit Design:

To effectively utilize 10AX027E1F27I1SG in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to minimize power consumption while ensuring stable operation of 10AX027E1F27I1SG and associated circuitry. Utilize power gating techniques and dynamic voltage scaling to optimize power usage during different operational modes.

2. Signal Integrity:

Ensure proper signal integrity by carefully designing PCB layouts and signal routing to minimize signal distortion, reflection, and crosstalk. Use impedance matching techniques and high-speed signal termination to maintain signal integrity, especially in high-frequency applications.

3. Thermal Management:

Implement effective thermal management solutions to dissipate heat generated by 10AX027E1F27I1SG and prevent overheating. Utilize heatsinks, thermal vias, and proper airflow design to maintain optimal operating temperatures and prevent thermal-induced performance degradation.

4. Clock Distribution:

Design a robust clock distribution network to ensure accurate and synchronized clock signals throughout the FPGA and associated components. Use low-skew clock routing techniques and clock tree synthesis optimization to minimize clock skew and jitter, ensuring reliable operation of synchronous digital circuits.

5. Design Partitioning:

Partition the design into smaller, manageable modules to facilitate parallel development and optimization. Utilize hierarchical design methodologies and IP core integration to efficiently reuse and integrate pre-validated design blocks, reducing development time and improving overall design reliability.

Considerations:

When optimizing the design using 10AX027E1F27I1SG, it's essential to consider:

- Resource Utilization: Efficiently utilize FPGA resources, such as logic elements and memory blocks, to meet performance and resource constraints.

- Timing Closure: Perform timing analysis and optimization to ensure that the design meets timing requirements and achieves maximum operating frequency.

- Design Verification: Thoroughly verify the design through simulation, emulation, and prototyping to identify and debug potential issues before deployment.

- Security: Implement security features, such as bitstream encryption and authentication, to protect the FPGA configuration and intellectual property from unauthorized access and tampering.

- Future Scalability: Design the system with scalability in mind to accommodate future upgrades and expansions, ensuring long-term viability and flexibility of the solution.

10AX027E1F27I1SG FAQ

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3. Are the 10AX027E1F27I1SG price and inventory displayed accurate?

The price and inventory of 10AX027E1F27I1SG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX027E1F27I1SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX027E1F27I1SG we delivered, we will accept the replacement or return of the 10AX027E1F27I1SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX027E1F27I1SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations