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Name: 10AX022E4F27E3SG
Brand: Intel
SKU: 10AX022E4F27E3SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX022E4F27E3SG

Part No.:: 10AX022E4F27E3SG

Manufacturer:: Intel

Package:: 672-BBGA, FCBGA

Datasheet:: 10AX022E4F27E3SG.pdf

Description:: IC FPGA 240 I/O 672FBGA

In Stock:: 2368

Quantity:: Add To Cart

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10AX022E4F27E3SG Specifications

Package/Case:
672-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
80330
NumberofLogicElements/Cells:
220000
TotalRAMBits:
13752320
NumberofI/O:
240
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

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10AX022E4F27E3SG information

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10AX022E4F27E3SG Application Introduction

10AX022E4F27E3SG is a field-programmable gate array (FPGA) with advanced features and capabilities, commonly used in high-performance computing and embedded systems for a wide range of applications.

Application Scenario:

In telecommunications infrastructure, 10AX022E4F27E3SG can be utilized to implement signal processing algorithms for data transmission and reception in wireless communication systems.

Circuit Design:

To effectively utilize 10AX022E4F27E3SG in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to minimize power consumption and maximize battery life. Utilize low-power modes and dynamic voltage scaling to adapt to varying workload demands.

2. Signal Integrity:

Ensure signal integrity by carefully designing the PCB layout and routing high-speed interfaces. Use impedance-matched traces and minimize signal reflections to maintain signal integrity and reduce data errors.

3. Thermal Management:

Manage thermal performance by incorporating heat sinks, thermal vias, and proper airflow in the system design. Monitor the temperature of 10AX022E4F27E3SG and implement dynamic thermal throttling to prevent overheating and ensure reliable operation.

4. Design Optimization:

Optimize the design for performance and resource utilization by leveraging the features and capabilities of 10AX022E4F27E3SG, such as pipelining, parallel processing, and hardware acceleration. Utilize advanced synthesis and optimization tools to maximize design efficiency and meet performance targets.

5. Clock Management:

Implement robust clock management strategies to ensure synchronous operation and minimize clock skew. Use dedicated clock networks and clock conditioning circuits to distribute and clean clock signals effectively throughout the design.

Considerations:

When designing with 10AX022E4F27E3SG, it's essential to consider:

- Resource Utilization: Optimize FPGA resource utilization to maximize design efficiency and minimize area overhead.

- Timing Closure: Perform comprehensive timing analysis and optimization to ensure that the design meets timing constraints and operates reliably at the desired clock frequency.

- Design Validation: Thoroughly validate the design through simulation, emulation, and prototyping to verify functionality, performance, and compliance with specifications.

- Design Security: Implement security measures, such as bitstream encryption and authentication, to protect intellectual property and prevent unauthorized access or tampering of the FPGA design.

- Design for Testability: Incorporate built-in self-test (BIST) and debug features to facilitate testing and debugging of the FPGA design during development and deployment.

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6. What is the process for return or replacement of 10AX022E4F27E3SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX022E4F27E3SG we delivered, we will accept the replacement or return of the 10AX022E4F27E3SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX022E4F27E3SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations