What is the Additional Feature ?

Name: 10AX022E3F29I2SG
Brand: Intel
SKU: 10AX022E3F29I2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX022E3F29I2SG

Part No.:: 10AX022E3F29I2SG

Manufacturer:: Intel

Package:: 780-BBGA, FCBGA

Datasheet:: 10AX022E3F29I2SG.pdf

Description:: IC FPGA 288 I/O 780FBGA

In Stock:: 3416

Quantity:: Add To Cart

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10AX022E3F29I2SG Specifications

Package/Case:
780-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
80330
NumberofLogicElements/Cells:
220000
TotalRAMBits:
13752320
NumberofI/O:
288
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX022E3F29I2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX022E3F29I2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX022E3F29I2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX022E3F29I2SG information

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10AX022E3F29I2SG Application Introduction

10AX022E3F29I2SG is a field-programmable gate array (FPGA) with advanced features, commonly used in high-performance computing and signal processing applications.

Application Scenario:

In telecommunications infrastructure, 10AX022E3F29I2SG can be utilized for implementing complex signal processing algorithms, such as digital filtering and modulation/demodulation techniques.

Circuit Design:

To optimize the design with 10AX022E3F29I2SG, consider the following aspects:

1. Power Management:

Implement efficient power management techniques to ensure stable and reliable operation of 10AX022E3F29I2SG and associated peripherals. Utilize voltage regulators and power sequencing circuits to minimize power supply noise and fluctuations.

2. Signal Integrity:

Pay attention to signal integrity by carefully designing the PCB layout and minimizing signal traces' length and impedance mismatches. Implement termination techniques, such as series resistors or parallel termination, to mitigate signal reflections and ensure reliable data transmission.

3. Thermal Management:

Ensure proper thermal management by incorporating heat sinks, thermal vias, and adequate airflow in the system enclosure to dissipate heat generated by 10AX022E3F29I2SG during operation. Monitor the FPGA's temperature and implement thermal shutdown mechanisms if necessary to prevent overheating.

4. Clocking:

Design a stable clocking architecture by using low-jitter clock sources and implementing clock distribution networks with proper buffering and fan-out considerations. Pay attention to clock skew and jitter to maintain timing accuracy in synchronous designs.

5. I/O Interface:

Optimize the I/O interface design by selecting appropriate I/O standards and implementing robust input/output buffer circuits. Pay attention to signal voltage levels, signal swing, and slew rates to ensure compatibility with external devices and minimize signal degradation.

Considerations:

When designing with 10AX022E3F29I2SG, keep the following considerations in mind:

- Resource Utilization: Efficiently utilize FPGA resources, such as logic elements, memory blocks, and DSP slices, to maximize design performance and minimize resource wastage.

- Timing Closure: Perform thorough timing analysis and optimization to ensure timing closure and meet the design's performance requirements. Utilize FPGA synthesis and place-and-route tools effectively to achieve timing closure.

- Design Debugging: Implement debug features, such as internal logic analyzers and JTAG interfaces, to facilitate design debugging and troubleshooting during the development phase.

- Design Security: Implement security measures, such as bitstream encryption and device-level authentication, to protect the FPGA design's intellectual property and prevent unauthorized access or tampering.

- Future Scalability: Design the system with future scalability in mind, allowing for easy expansion or upgrades to accommodate evolving application requirements or technology advancements.

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3. Are the 10AX022E3F29I2SG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX022E3F29I2SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX022E3F29I2SG we delivered, we will accept the replacement or return of the 10AX022E3F29I2SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX022E3F29I2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations