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Name: 10AX022E3F29I2LG
Brand: Intel
SKU: 10AX022E3F29I2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX022E3F29I2LG

Part No.:: 10AX022E3F29I2LG

Manufacturer:: Intel

Package:: 780-BBGA, FCBGA

Datasheet:: 10AX022E3F29I2LG.pdf

Description:: IC FPGA 288 I/O 780FBGA

In Stock:: 3253

Quantity:: Add To Cart

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10AX022E3F29I2LG Specifications

Package/Case:
780-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
80330
NumberofLogicElements/Cells:
220000
TotalRAMBits:
13752320
NumberofI/O:
288
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX022E3F29I2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX022E3F29I2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX022E3F29I2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX022E3F29I2LG information

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10AX022E3F29I2LG Application Introduction

10AX022E3F29I2LG is a field-programmable gate array (FPGA) chip designed by Intel, offering high-performance processing capabilities and versatile programmability for a wide range of applications.

Application Scope:

In the realm of digital signal processing (DSP), 10AX022E3F29I2LG can be utilized for tasks such as real-time audio processing, image recognition, and wireless communication signal modulation.

Circuit Design:

To leverage 10AX022E3F29I2LG effectively in a design project, adhere to the following guidelines:

1. Power Management:

Implement robust power supply and management solutions to ensure stable voltage and current delivery to 10AX022E3F29I2LG and associated peripherals. Utilize high-quality voltage regulators, decoupling capacitors, and power planes to minimize noise and ensure reliable operation.

2. Signal Integrity:

Design the PCB layout carefully, paying attention to signal routing, impedance matching, and ground plane design to maintain signal integrity and minimize crosstalk. Proper termination techniques should be employed for high-speed interfaces to mitigate signal reflections and ensure accurate data transmission.

3. Thermal Management:

Implement effective thermal management strategies, such as heatsinking and airflow optimization, to dissipate heat generated by 10AX022E3F29I2LG and prevent overheating. Ensure adequate spacing between components to facilitate heat dissipation and consider environmental factors, such as ambient temperature and airflow, during system operation.

4. Clock Distribution:

Design a robust clock distribution network to provide stable and synchronized clock signals to 10AX022E3F29I2LG and other clock-dependent components. Utilize low-skew clock distribution techniques, such as dedicated clock lines and clock buffers, to minimize clock jitter and ensure reliable system operation.

5. I/O Planning:

Carefully plan the I/O configuration and placement to optimize signal routing and minimize signal skew. Group related I/O interfaces together to simplify board routing and reduce signal interference. Utilize differential signaling and impedance matching techniques for high-speed serial interfaces to maximize signal integrity and minimize noise.

Considerations:

When designing with 10AX022E3F29I2LG, consider the following factors:

- Performance Requirements: Evaluate the performance specifications of 10AX022E3F29I2LG to ensure compatibility with the intended application requirements and performance targets.

- Resource Utilization: Optimize FPGA resource utilization to maximize design efficiency and minimize resource constraints. Utilize tools such as synthesis and optimization software to streamline the design process and improve resource utilization.

- System Integration: Integrate 10AX022E3F29I2LG seamlessly into the overall system architecture, considering compatibility with other components, interfaces, and communication protocols.

- Testing and Validation: Conduct thorough testing and validation of the design to verify functionality, performance, and reliability under various operating conditions and stress scenarios.

- Future Scalability: Design the system with future scalability in mind, allowing for potential upgrades and expansions to accommodate evolving application requirements and technological advancements.

10AX022E3F29I2LG FAQ

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3. Are the 10AX022E3F29I2LG price and inventory displayed accurate?

The price and inventory of 10AX022E3F29I2LG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX022E3F29I2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX022E3F29I2LG we delivered, we will accept the replacement or return of the 10AX022E3F29I2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX022E3F29I2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations