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Name: 10AX022E3F27I2LG
Brand: Intel
SKU: 10AX022E3F27I2LG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX022E3F27I2LG

Part No.:: 10AX022E3F27I2LG

Manufacturer:: Intel

Package:: 672-BBGA, FCBGA

Datasheet:: 10AX022E3F27I2LG.pdf

Description:: IC FPGA 240 I/O 672FBGA

In Stock:: 3232

Quantity:: Add To Cart

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10AX022E3F27I2LG Specifications

Package/Case:
672-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
80330
NumberofLogicElements/Cells:
220000
TotalRAMBits:
13752320
NumberofI/O:
240
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX022E3F27I2LG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX022E3F27I2LG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX022E3F27I2LG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX022E3F27I2LG information

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10AX022E3F27I2LG Application Introduction

10AX022E3F27I2LG is a field-programmable gate array (FPGA) device offering high performance and flexibility, suitable for a wide range of applications in digital design projects.

Application Scenario:

In digital signal processing (DSP) applications, 10AX022E3F27I2LG can be utilized to implement complex algorithms for tasks such as audio processing or image recognition.

Circuit Design:

To effectively utilize 10AX022E3F27I2LG in your design, consider the following optimization techniques:

1. Power Management:

Implement efficient power management strategies to ensure optimal power consumption. Utilize low-power modes and power gating techniques to minimize energy consumption during idle periods. Utilize advanced power analysis tools provided by the FPGA vendor to optimize power usage.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal integrity issues such as crosstalk and signal reflections. Use controlled impedance traces for high-speed interfaces and minimize signal routing length to reduce propagation delay. Perform signal integrity analysis using tools like HyperLynx to validate signal integrity.

3. Thermal Management:

Ensure effective thermal management to prevent overheating and ensure reliable operation. Implement heat sinks or thermal vias to dissipate heat efficiently from the FPGA device. Consider ambient temperature and airflow in the system enclosure to optimize thermal performance.

4. Clocking Strategy:

Develop a robust clocking strategy to ensure reliable clock distribution and minimize clock skew. Utilize PLLs and DLLs within the FPGA to generate stable clock signals with low jitter. Perform timing analysis to validate timing constraints and optimize clock routing for critical paths.

5. Design Partitioning:

Partition the design into smaller modules to facilitate easier design implementation and debug. Use hierarchical design techniques to manage complexity and promote reusability of design blocks. Implement proper interfacing protocols between modules to ensure seamless communication and interoperability.

Considerations:

When designing with 10AX022E3F27I2LG, it's essential to consider:

- Resource Utilization: Optimize resource utilization to maximize FPGA performance and minimize resource conflicts.

- Design Constraints: Adhere to design constraints such as timing, area, and power to ensure design functionality and performance meet specifications.

- Verification and Testing: Perform thorough verification and testing of the design using simulation and hardware testing to ensure functional correctness and reliability.

- Design Security: Implement security measures such as encryption and authentication to protect the FPGA design from unauthorized access and tampering.

- Documentation: Maintain comprehensive documentation of the design including design specifications, test plans, and implementation details for future reference and troubleshooting.

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3. Are the 10AX022E3F27I2LG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX022E3F27I2LG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX022E3F27I2LG we delivered, we will accept the replacement or return of the 10AX022E3F27I2LG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX022E3F27I2LG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations