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Name: 10AX022E3F27E1SG
Brand: Intel
SKU: 10AX022E3F27E1SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX022E3F27E1SG

Part No.:: 10AX022E3F27E1SG

Manufacturer:: Intel

Package:: 672-BBGA, FCBGA

Datasheet:: 10AX022E3F27E1SG.pdf

Description:: IC FPGA 240 I/O 672FBGA

In Stock:: 3601

Quantity:: Add To Cart

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10AX022E3F27E1SG Specifications

Package/Case:
672-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Discontinued at Mosen
NumberofLABs/CLBs:
80330
NumberofLogicElements/Cells:
220000
TotalRAMBits:
13752320
NumberofI/O:
240
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AX022E3F27E1SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX022E3F27E1SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX022E3F27E1SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX022E3F27E1SG information

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10AX022E3F27E1SG Application Introduction

10AX022E3F27E1SG is a Field-Programmable Gate Array (FPGA) device known for its high performance and versatility in various electronic design projects.

Application Scenario:

In digital signal processing applications, 10AX022E3F27E1SG can be utilized for tasks such as real-time data processing in radar systems or image processing in medical devices.

Circuit Design:

To effectively integrate 10AX022E3F27E1SG into your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure 10AX022E3F27E1SG operates within its specified power supply requirements. Use voltage regulators and power monitoring circuits to maintain stable voltage levels and prevent overloading.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal interference and ensure proper signal integrity. Pay attention to signal routing, impedance matching, and ground plane design to mitigate signal degradation and noise.

3. Thermal Management:

To prevent overheating and ensure reliable operation, incorporate effective thermal management solutions such as heat sinks, thermal vias, and fans. Properly dissipate heat generated during operation to maintain optimal FPGA performance.

4. Clock Distribution:

Optimize the clock distribution network to ensure accurate and stable clock signals reach 10AX022E3F27E1SG. Use low-skew clock distribution techniques and minimize clock skew to synchronize timing across the FPGA.

5. I/O Optimization:

Maximize the utilization of I/O resources by carefully planning and optimizing the I/O assignments. Group related I/O signals together and use high-speed serial transceivers efficiently for data communication tasks.

Considerations:

When designing with 10AX022E3F27E1SG, keep in mind the following considerations for optimal performance and reliability:

- Timing Closure: Perform thorough timing analysis and ensure timing constraints are met to avoid timing violations and optimize overall system performance.

- Resource Utilization: Efficiently utilize FPGA resources such as logic cells, memory blocks, and DSP slices to minimize resource wastage and maximize design flexibility.

- EMI/EMC Compliance: Design the PCB layout and enclosure to minimize electromagnetic interference and ensure compliance with electromagnetic compatibility regulations.

- Security: Implement security features such as bitstream encryption and authentication mechanisms to protect the FPGA design from unauthorized access and tampering.

- Design Verification: Thoroughly test the FPGA design using simulation and verification techniques to identify and rectify any functional or performance issues before deployment.

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3. Are the 10AX022E3F27E1SG price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AX022E3F27E1SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX022E3F27E1SG we delivered, we will accept the replacement or return of the 10AX022E3F27E1SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX022E3F27E1SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations