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Name: 10AX016E4F29I3SG
Brand: Intel
SKU: 10AX016E4F29I3SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX016E4F29I3SG

Part No.:: 10AX016E4F29I3SG

Manufacturer:: Intel

Package:: 780-BBGA, FCBGA

Datasheet:: 10AX016E4F29I3SG.pdf

Description:: IC FPGA 288 I/O 780FBGA

In Stock:: 2382

Quantity:: Add To Cart

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10AX016E4F29I3SG Specifications

Package/Case:
780-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
61510
NumberofLogicElements/Cells:
160000
TotalRAMBits:
10086400
NumberofI/O:
288
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX016E4F29I3SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX016E4F29I3SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX016E4F29I3SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX016E4F29I3SG information

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10AX016E4F29I3SG Application Introduction

10AX016E4F29I3SG is a Field Programmable Gate Array (FPGA) known for its versatility and high-performance capabilities, commonly utilized in various electronic design projects for signal processing, control systems, and data processing applications.

Application Scenario:

In digital signal processing applications, 10AX016E4F29I3SG can be employed to implement complex algorithms for real-time data analysis and manipulation, such as audio and video processing in multimedia systems.

Circuit Design:

To effectively utilize 10AX016E4F29I3SG in a design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power supply and management solutions to ensure stable voltage levels and minimize power consumption of 10AX016E4F29I3SG and associated components. Utilize low-dropout regulators and power-saving modes to enhance energy efficiency.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal degradation and electromagnetic interference. Proper grounding and shielding techniques should be employed to maintain signal integrity and reduce noise susceptibility, especially in high-speed data transmission applications.

3. Thermal Management:

Ensure adequate thermal dissipation for 10AX016E4F29I3SG to prevent overheating and maintain reliable operation. Incorporate heat sinks, thermal vias, and proper airflow within the enclosure to dissipate heat effectively and avoid thermal throttling.

4. Clock Distribution:

Optimize clock distribution networks to minimize clock skew and jitter, ensuring precise synchronization of internal logic elements within 10AX016E4F29I3SG. Use low-phase noise oscillators and proper termination techniques to maintain signal integrity and timing accuracy.

5. I/O Planning:

Carefully plan and allocate I/O resources of 10AX016E4F29I3SG based on the project requirements and connectivity needs. Utilize differential signaling and impedance matching techniques for high-speed serial interfaces to minimize signal reflections and improve noise immunity.

Considerations:

When designing with 10AX016E4F29I3SG, it's essential to consider:

- Resource Utilization: Optimize FPGA resource utilization to maximize performance and minimize resource conflicts.

- Design Validation: Perform thorough simulation and validation tests to verify the functionality and performance of the design under different operating conditions.

- Design Reusability: Modularize the design to facilitate reusability and scalability for future projects or design iterations.

- Security Considerations: Implement security measures, such as bitstream encryption and authentication, to protect the intellectual property and ensure the integrity of the FPGA configuration.

- Documentation: Maintain comprehensive documentation of the design, including schematics, PCB layouts, and firmware/software source code, to facilitate troubleshooting, debugging, and future maintenance.

10AX016E4F29I3SG FAQ

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3. Are the 10AX016E4F29I3SG price and inventory displayed accurate?

The price and inventory of 10AX016E4F29I3SG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX016E4F29I3SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX016E4F29I3SG we delivered, we will accept the replacement or return of the 10AX016E4F29I3SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX016E4F29I3SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations