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Name: 10AX016E3F27I2SG
Brand: Intel
SKU: 10AX016E3F27I2SG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AX016E3F27I2SG

Part No.:: 10AX016E3F27I2SG

Manufacturer:: Intel

Package:: 672-BBGA, FCBGA

Datasheet:: 10AX016E3F27I2SG.pdf

Description:: IC FPGA 240 I/O 672FBGA

In Stock:: 2893

Quantity:: Add To Cart

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10AX016E3F27I2SG Specifications

Package/Case:
672-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GX
ProductStatus:
Active
NumberofLABs/CLBs:
61510
NumberofLogicElements/Cells:
160000
TotalRAMBits:
10086400
NumberofI/O:
240
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.98V
MountingType:
Surface Mount
OperatingTemperature:
-40°C ~ 100°C (TJ)

10AX016E3F27I2SG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AX016E3F27I2SG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AX016E3F27I2SG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AX016E3F27I2SG information

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10AX016E3F27I2SG Application Introduction

10AX016E3F27I2SG is a field-programmable gate array (FPGA) device known for its high performance and flexibility, commonly used in a variety of digital design projects. It features abundant logic resources, versatile I/O capabilities, and efficient power management options.

Application Scenario:

In digital signal processing applications, 10AX016E3F27I2SG can be utilized to implement complex algorithms for tasks such as image processing, audio processing, and communication protocols.

Circuit Design:

To effectively utilize 10AX016E3F27I2SG in your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to optimize power consumption and prolong battery life in portable applications. Utilize features such as dynamic voltage and frequency scaling (DVFS) to adjust the operating parameters of the FPGA based on workload requirements.

2. Signal Integrity:

Ensure proper signal integrity by carefully designing the PCB layout to minimize signal reflections, crosstalk, and impedance mismatches. Utilize high-speed design guidelines and impedance-controlled traces for critical signal paths to maintain signal integrity.

3. Thermal Management:

Manage thermal dissipation effectively to prevent overheating and ensure reliable operation of the 10AX016E3F27I2SG device. Utilize thermal vias, heat sinks, and fans to dissipate heat generated during operation and maintain the FPGA's operating temperature within safe limits.

4. Clock Distribution:

Optimize clock distribution to minimize clock skew and jitter, ensuring synchronous operation of the FPGA and connected peripherals. Use dedicated clock routing resources and clock tree synthesis techniques to achieve precise timing control and reduce clock-related issues.

5. Design Partitioning:

Partition the design into manageable modules to facilitate ease of development, testing, and debugging. Utilize hierarchical design methodologies and IP core integration to reuse pre-verified modules and accelerate the design process.

Considerations:

When designing with 10AX016E3F27I2SG, consider the following factors:

- Resource Utilization: Optimize resource utilization to maximize the efficiency of the FPGA and minimize resource contention.

- Timing Closure: Ensure timing closure by carefully analyzing timing constraints and performing timing-driven synthesis and place-and-route optimizations.

- Design Security: Implement security features, such as bitstream encryption and authentication, to protect the intellectual property and prevent unauthorized access to the FPGA configuration.

- Design Verification: Conduct thorough functional verification and simulation testing to validate the correctness and reliability of the FPGA design before deployment.

- Design for Testability: Incorporate built-in self-test (BIST) features and debug interfaces to facilitate post-manufacturing testing and debugging of the FPGA-based system.

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3. Are the 10AX016E3F27I2SG price and inventory displayed accurate?

The price and inventory of 10AX016E3F27I2SG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of 10AX016E3F27I2SG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AX016E3F27I2SG we delivered, we will accept the replacement or return of the 10AX016E3F27I2SG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AX016E3F27I2SG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations