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Name: 10AT115U3F45E2SGES
Brand: Intel
SKU: 10AT115U3F45E2SGES
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AT115U3F45E2SGES

Part No.:: 10AT115U3F45E2SGES

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 10AT115U3F45E2SGES.pdf

Description:: IC FPGA 624 I/O 1932FCBGA

In Stock:: 2341

Quantity:: Add To Cart

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10AT115U3F45E2SGES Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GT
ProductStatus:
Obsolete
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
624
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AT115U3F45E2SGES this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AT115U3F45E2SGES price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AT115U3F45E2SGES to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AT115U3F45E2SGES information

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10AT115U3F45E2SGES Application Introduction

10AT115U3F45E2SGES is a highly integrated system-on-chip (SoC) designed for advanced digital signal processing applications, offering high performance and flexibility for a wide range of designs.

Application Scenario:

In digital signal processing applications, 10AT115U3F45E2SGES can be utilized for tasks such as audio processing, image recognition, and telecommunications signal modulation.

Circuit Design:

To design an efficient signal processing system using 10AT115U3F45E2SGES, consider the following optimization techniques:

1. Power Management:

Implement dynamic voltage and frequency scaling (DVFS) techniques to optimize power consumption based on the processing workload. Utilize low-power modes during idle periods and employ efficient power regulators to minimize energy waste.

2. Signal Integrity:

Design the PCB layout to minimize signal crosstalk and electromagnetic interference (EMI). Use differential signaling for critical high-speed interfaces and incorporate signal conditioning components, such as filters and impedance matching networks, to ensure robust signal integrity.

3. Thermal Management:

Utilize thermal vias and heatsinks to dissipate heat efficiently from the 10AT115U3F45E2SGES SoC. Ensure adequate airflow and ventilation within the system enclosure to prevent thermal throttling and maintain optimal operating temperatures.

4. Clock Distribution:

Optimize clock distribution within the system to minimize skew and jitter. Use low-phase noise clock sources and employ clock tree synthesis techniques to achieve synchronous operation and minimize timing uncertainties.

5. Memory Management:

Optimize memory access patterns and utilize cache hierarchies to reduce memory latency and improve overall system performance. Implement data prefetching and memory compression techniques to maximize memory bandwidth utilization.

Considerations:

When designing with 10AT115U3F45E2SGES, it's essential to consider:

- Algorithm Optimization: Develop efficient signal processing algorithms tailored to the hardware architecture to maximize performance and resource utilization.

- System Integration: Integrate peripheral interfaces and external memory modules seamlessly into the system architecture to facilitate data transfer and external device connectivity.

- Validation and Testing: Conduct comprehensive testing and validation procedures to ensure the reliability, stability, and accuracy of the signal processing system under various operating conditions and input scenarios.

- Firmware Optimization: Optimize firmware code for the 10AT115U3F45E2SGES platform, considering factors such as code size, execution speed, and power efficiency.

- Security Considerations: Implement robust security measures, such as data encryption and secure boot mechanisms, to protect sensitive information and ensure the integrity of the signal processing system.

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3. Are the 10AT115U3F45E2SGES price and inventory displayed accurate?

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6. What is the process for return or replacement of 10AT115U3F45E2SGES?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AT115U3F45E2SGES we delivered, we will accept the replacement or return of the 10AT115U3F45E2SGES only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AT115U3F45E2SGES.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations