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Name: 10AT115S2F45E2SGE2
Brand: Intel
SKU: 10AT115S2F45E2SGE2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Intel 10AT115S2F45E2SGE2

Part No.:: 10AT115S2F45E2SGE2

Manufacturer:: Intel

Package:: 1932-BBGA, FCBGA

Datasheet:: 10AT115S2F45E2SGE2.pdf

Description:: IC FPGA 624 I/O 1932FCBGA

In Stock:: 2867

Quantity:: Add To Cart

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10AT115S2F45E2SGE2 Specifications

Package/Case:
1932-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GT
ProductStatus:
Active
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
624
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AT115S2F45E2SGE2 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AT115S2F45E2SGE2 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AT115S2F45E2SGE2 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AT115S2F45E2SGE2 information

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10AT115S2F45E2SGE2 Application Introduction

10AT115S2F45E2SGE2 is a highly integrated system-on-chip (SoC) designed for advanced embedded applications, offering a wide range of features and capabilities.

Application Scenario:

In automotive electronics, 10AT115S2F45E2SGE2 can be utilized for implementing complex control systems, such as engine management or advanced driver-assistance systems (ADAS).

Circuit Design:

To effectively utilize 10AT115S2F45E2SGE2 in your design, consider the following steps:

1. Power Management:

Implement robust power supply and management solutions to ensure stable voltage and current delivery to 10AT115S2F45E2SGE2 and its peripherals. Utilize voltage regulators, such as buck or boost converters, along with appropriate decoupling capacitors to minimize noise and voltage fluctuations.

2. Signal Integrity:

Design the PCB layout carefully to minimize signal interference and maintain signal integrity. Use proper grounding techniques, signal routing guidelines, and impedance matching to mitigate signal reflections and crosstalk. Pay special attention to high-speed interfaces, such as DDR memory or high-speed serial links, to ensure reliable data transmission.

3. Thermal Management:

Ensure adequate thermal dissipation for 10AT115S2F45E2SGE2 to prevent overheating and ensure reliable operation. Utilize thermal vias, heat sinks, or thermal pads to dissipate heat effectively from critical components. Consider ambient temperature conditions and airflow within the enclosure to optimize thermal performance.

4. Peripheral Interface:

Utilize the integrated peripherals of 10AT115S2F45E2SGE2, such as GPIOs, UARTs, SPI, I2C, and CAN interfaces, to interface with external sensors, actuators, and communication devices. Configure the peripheral pins according to the system requirements and communication protocols.

5. System Integration:

Integrate 10AT115S2F45E2SGE2 seamlessly into the overall system architecture, considering factors such as system reliability, scalability, and modularity. Utilize software frameworks, such as RTOS or middleware libraries, to streamline development and enhance system functionality.

Considerations:

When designing with 10AT115S2F45E2SGE2, it's essential to consider:

- EMI/EMC Compliance: Ensure the design complies with electromagnetic interference (EMI) and electromagnetic compatibility (EMC) standards to minimize interference and ensure proper operation in the intended environment.

- Firmware Optimization: Optimize firmware algorithms and software routines to maximize performance, minimize power consumption, and enhance system responsiveness.

- Test and Validation: Thoroughly test the system design through simulation, prototyping, and validation to identify and resolve potential issues early in the development cycle. Perform comprehensive testing under various operating conditions to ensure reliability and robustness.

- Lifecycle Management: Consider the long-term availability and support of 10AT115S2F45E2SGE2 and its associated components to ensure continuity of production and maintenance throughout the product lifecycle.

10AT115S2F45E2SGE2 FAQ

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3. Are the 10AT115S2F45E2SGE2 price and inventory displayed accurate?

The price and inventory of 10AT115S2F45E2SGE2 fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of 10AT115S2F45E2SGE2?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AT115S2F45E2SGE2 we delivered, we will accept the replacement or return of the 10AT115S2F45E2SGE2 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AT115S2F45E2SGE2.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations