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Name: 10AT115N3F40E2SGE2
Brand: Intel
SKU: 10AT115N3F40E2SGE2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Intel 10AT115N3F40E2SGE2

Part No.:: 10AT115N3F40E2SGE2

Manufacturer:: Intel

Package:: 1517-BBGA, FCBGA

Datasheet:: 10AT115N3F40E2SGE2.pdf

Description:: IC FPGA 600 I/O 1517FBGA

In Stock:: 2628

Quantity:: Add To Cart

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10AT115N3F40E2SGE2 Specifications

Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Series:
Arria 10 GT
ProductStatus:
Obsolete
NumberofLABs/CLBs:
427200
NumberofLogicElements/Cells:
1150000
TotalRAMBits:
68857856
NumberofI/O:
600
NumberofGates:
-
Voltage-Supply:
0.87V ~ 0.93V
MountingType:
Surface Mount
OperatingTemperature:
0°C ~ 100°C (TJ)

10AT115N3F40E2SGE2 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including 10AT115N3F40E2SGE2 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for 10AT115N3F40E2SGE2 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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10AT115N3F40E2SGE2 information

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10AT115N3F40E2SGE2 Application Introduction

10AT115N3F40E2SGE2 is a versatile FPGA (Field Programmable Gate Array) device widely used in various electronic design projects for its high performance and flexibility.

Application Scenario:

In digital signal processing applications, 10AT115N3F40E2SGE2 can be utilized to implement complex algorithms for tasks such as image processing or audio filtering.

Circuit Design:

To effectively integrate 10AT115N3F40E2SGE2 into your design project, consider the following optimization techniques:

1. Power Management:

Implement efficient power management techniques to ensure the stable operation of 10AT115N3F40E2SGE2 and associated components. Utilize voltage regulators and power sequencing circuits to provide clean and regulated power supply to the FPGA.

2. Signal Integrity:

Pay special attention to signal integrity to maintain reliable communication within the FPGA and with external devices. Use proper termination techniques, impedance matching, and signal conditioning circuits to minimize signal distortion and ensure accurate data transmission.

3. Thermal Management:

Prevent overheating of 10AT115N3F40E2SGE2 by implementing effective thermal management strategies. Utilize heat sinks, fans, or thermal vias in the PCB layout to dissipate heat generated during operation and maintain optimal operating temperature.

4. Clock Distribution:

Design a robust clock distribution network to ensure synchronous operation of different modules within the FPGA design. Use low-skew clock distribution techniques and proper clock routing to minimize clock skew and ensure accurate timing synchronization.

5. I/O Planning:

Optimize the I/O planning for 10AT115N3F40E2SGE2 to efficiently interface with external peripherals and devices. Group related I/O signals, use differential signaling for high-speed interfaces, and allocate appropriate I/O standards to ensure reliable communication.

Considerations:

When designing with 10AT115N3F40E2SGE2, keep the following considerations in mind:

- Design for Testability: Include built-in self-test (BIST) features and diagnostic circuits to facilitate testing and debugging of the FPGA design.

- Design Security: Implement security features such as encryption, authentication, and tamper detection to protect the FPGA configuration and intellectual property from unauthorized access or tampering.

- Design Optimization: Continuously optimize the FPGA design through iterative refinement, resource utilization analysis, and performance profiling to achieve the desired functionality with minimal resource usage and maximum efficiency.

- Environmental Considerations: Consider environmental factors such as temperature, humidity, and vibration during the design phase to ensure reliable operation of 10AT115N3F40E2SGE2 in various operating conditions.

- Compliance and Standards: Ensure compliance with industry standards and regulations relevant to your application, such as EMC/EMI compliance, safety standards, and interoperability requirements, to facilitate product certification and market acceptance.

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6. What is the process for return or replacement of 10AT115N3F40E2SGE2?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the 10AT115N3F40E2SGE2 we delivered, we will accept the replacement or return of the 10AT115N3F40E2SGE2 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of 10AT115N3F40E2SGE2.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations