xMEMS Announces Innovative Micro Cooling Technology

xMEMS Labs recently announced a groundbreaking new technology: the xMEMS XMC-2400 µCooling™ chip. This all-silicon micro air-cooled active cooling chip is designed specifically for the next generation of ultra-portable devices and artificial intelligence (AI) solutions, offering exceptional cooling performance and an ultra-thin form factor.

µCooling Innovation: Driving a New Trend in Portable Device Cooling

The µCooling innovation presented by xMEMS Labs highlights an all-silicon smaller scale air-cooled dynamic cooling plan, giving a novel arrangement for cooling shrewd gadgets. The XMC-2400 µCooling™ chip is as it were 1 millimeter thick and offers quiet, vibration-free solid-state cooling capabilities. It viably addresses the cooling challenges in smartphones, tablets, and other gadgets whereas keeping up their thin profiles. This innovation guarantees productive warm administration, encourage improving the client encounter of versatile gadgets. Concurring to xMEMS co-founder and CEO Joseph Jiang, the expanding number of processor-intensive AI applications running on ultra-portable gadgets has made warm administration a major challenge for producers and clients. The XMC-2400 fills the hole within the showcase by advertising an successful dynamic cooling arrangement for little versatile gadgets.

Technical Advantages of the Micro Air-Cooled Active Cooling Chip

The XMC-2400 µCooling™ chip measures just 9.26 x 7.6 x 1.08 millimeters and weighs less than 150 milligrams. Compared to traditional non-silicon-based active cooling solutions, its volume and weight are reduced by 96%. This chip can move up to 39 cubic centimeters of air per second at 1000Pa back pressure, demonstrating outstanding cooling efficiency. Additionally, the XMC-2400 is made from all-silicon materials, ensuring high reliability, consistency between components, strong impact resistance, and IP58-rated dust and water protection.
"We developed this µCooling chip using the same manufacturing process as the xMEMS Cypress full-range micro speaker," Jiang added. The Cypress speaker has been widely adopted in in-ear wireless earbuds with ANC functionality and is expected to enter mass production in the second quarter of 2025. Several customers have already committed to using this technology, which will significantly enhance the performance and user experience of consumer electronics.

Looking Ahead: Redefining Thermal Management for Mobile Devices

xMEMS plans to launch samples of the XMC-2400 µCooling™ chip in the first quarter of 2025, which is expected to attract widespread attention and adoption in the industry. Jiang stated that µCooling technology will bring a new direction to the field of thermal management. The XMC-2400 not only provides efficient active cooling for the smallest handheld devices but also lays a solid foundation for developing thinner, more efficient AI-powered mobile devices. In the future, µCooling technology will become an essential component of smartphones and other slim, high-performance devices.
This development from xMEMS Labs not as it were grandstands the company's profound skill in miniaturization and high-performance innovations but moreover opens up unused conceivable outcomes for the plan and application of future convenient gadgets. With the broad appropriation of µCooling innovation, portable gadgets will enter a modern stage of being more proficient, shrewdly, and lightweight. The presentation of this innovation will assist drive advancement in versatile gadgets, driving to comprehensive enhancements in execution and client encounter.