A practical guide to hybrid integrated circuit design

Hybrid integrated circuits are an indispensable key technology in the electronic field. Its application range covers analog circuits, microwave circuits, high-voltage and high-current special circuits, and other fields, including but not limited to portable radios, airborne radios, electronic computers, and other equipment. Hybrid integration technology is developing rapidly in many interesting directions, including multi-layer wiring, carrier tape welding technology, research and development of high-power circuits, improvements in film forming technology, and substrate assembly. In terms of film formation technology, widely used methods include screen printing sintering and vacuum film forming, which are used to manufacture thick film and thin film hybrid integrated circuits respectively. In the microwave field, hybrid integrated circuits are also divided into concentrated parameter and distributed parameter microwave hybrid integrated circuits, depending on the centralized or dispersed distribution of component parameters.

The design and implementation of hybrid integrated circuits involves multiple key steps, including design planning, system modeling, division of digital circuits and analog circuits, circuit-level design and simulation, layout-level design and post-simulation, and final tape-out manufacturing. System modeling needs to fully consider the hybrid characteristics of the circuit, and usually requires the use of various software tools, such as Matlab, C language, SystemC, SPW, etc., for system-level design. In terms of circuit-level design and simulation, involving digital circuits and analog circuits, different design methods and processes are usually required. Hybrid simulation can include mixed simulation of register transfer-level digital circuits and transistor-level analog circuits, or mixed simulation of gate-level, transistor-level digital circuits and analog circuits. Layout-level design and post-simulation include layout design, design rule checking, layout verification, parasitic parameter extraction, etc., and finally post-simulation of mixed-signal circuits. Tape-out manufacturing is to make a mask plate after the post-simulation is completed and complete the circuit manufacturing through the assembly line process.

Types of hybrid integrated circuits include thick-film hybrid integrated circuits and thin-film hybrid integrated circuits, as well as microwave hybrid integrated circuits dedicated to microwave applications. These circuits can be divided into different types based on the concentration or distribution of component parameters. Film-forming technology is a crucial link in the manufacturing of hybrid integrated circuits. Screen printing sintering and vacuum film forming are two commonly used technologies, and the film thicknesses they produce are different. The passive network of thick-film hybrid integrated circuits is usually composed of electronic components with a distinguishable appearance, while thin-film hybrid integrated circuits rely more on microstrip lines to build passive networks, so the requirements for precise control of the size of microstrip lines are higher.

Hybrid integrated circuits play a vital role in today's electronics landscape, providing superior performance and versatility for a variety of applications. Their wide range of applications include, but are not limited to, analog circuits, microwave circuits, and specialized circuits requiring high voltages and currents used in portable electronics, airborne communications equipment, electronic computers, and more. The rapid evolution of hybrid integration technology brings unlimited potential for the future. Some key development trends include:

1. Multi-layer wiring and carrier tape soldering technology: Advances in these technologies allow more functions to be integrated onto a single chip, thereby reducing circuit board complexity and improving performance and reliability. The use of multi-layer wiring and carrier tape welding technology makes complex multi-functional, high-density hybrid integrated circuits possible.

2. Development of passive networks: Improvements in passive networks have made the integration of components closer, more precise, and more reliable. This promotes the development of integrated sensors to provide higher-performance solutions in a variety of fields.

3. High-power, high-voltage, and high-temperature-resistant circuits: As the demand for high-power, high-voltage, and high-temperature environment circuits increases, the development of hybrid integrated circuits will be more focused on meeting the needs of these special applications, such as power management and motor control Waitt.

4. Improvements in film-forming technology: Continuous improvements in film-forming technology will help improve the manufacturing process of thin-film active devices, thus promoting the application of hybrid integrated circuits in various fields.

5. Substrate assembly: Using substrates with interconnections to assemble microchip-like leadless components and devices is expected to reduce the manufacturing cost of electronic devices and improve their performance and maintainability.

In addition, the film formation technology of hybrid integrated circuits is crucial. Screen printing sintering and vacuum filmmaking are two common methods, and the thickness of the films they produce are different. Thick-film hybrid integrated circuits are usually composed of visible electronic components, while the passive network of thin-film hybrid integrated circuits is mainly composed of micros triplines, This requires high precision in dimensional control of micron three lines.

Overall, hybrid integrated circuit technology has broad applications and exciting future prospects in electronics. As technology continues to advance, we can expect to see more innovations and breakthroughs, further improving the performance and functionality of various electronic devices, and making greater contributions to technological development and social progress. Hybrid integrated circuits have become a mainstay of the modern electronics industry and their importance will continue to grow.