Says Electronics Leads Innovation in Voice Chips

Sais Electronics, a leading domestic manufacturer of mixed-signal chips, recently announced the launch of a new generation of voice chips (Subscriber Line Interface Circuit, SLIC chips). This product is specifically designed for telecommunications infrastructure and VOIP gateways, featuring high integration, programmability, and customization capabilities. The chip has already achieved high-yield mass production on mainstream platforms of several well-known domestic manufacturers and is expected to further drive the construction of FTTR (Fiber-to-the-Room) networks.

FTTR Network Construction Boosts Demand for Voice Chips

The construction of FTTR networks has created a market demand exceeding 130 billion yuan. This new networking model significantly enhances the demand for household and enterprise gateways as well as optical modem router terminals. According to forecasts, during the "14th Five-Year Plan" period, the FTTR transformation in China will bring significant market growth and provide broader opportunities for the development of telecommunications equipment. Recently, telecommunications operators have begun large-scale procurement of FTTR equipment, accelerating the deployment of commercial FTTR and achieving dual-gigabit network coverage.

FTTR networks require fiber optic cables to be installed in every room, with optical modems as the core devices connecting gigabit or multi-gigabit fiber optic access to provide internet services for smart devices. Voice chips play a crucial role in this process, and market demand for them continues to grow, further driving the development of this sector.

Sais' Self-Developed Voice Chips Lead the Way in Technology

Sais Electronics' self-developed voice chips provide strong technical support for the promotion of FTTR. As the core devices for fiber optic transmission, optical modems have long faced challenges in the voice chip supply chain, affecting both cost and performance for equipment manufacturers. The ASX630 series of voice chips from Sais successfully overcomes these technical bottlenecks. These chips not only meet global telecommunications standards but also significantly enhance integration, reduce power consumption, and lower BOM costs, offering efficient and cost-effective solutions for telecommunications infrastructure and consumer VoIP applications.

Continuous Innovation Drives Industry Upgrades

Through the integration of multiple core technologies, Sais Electronics has achieved self-development of voice chips within just two years. This success is attributed to the company's outstanding R&D team and years of industry experience. Sais' breakthroughs in voice chips have not only secured a favorable position in the market but have also set a new benchmark for the domestic mixed-signal chip industry.

Looking ahead, Sais Electronics will continue to deepen its efforts in the mixed-signal chip sector, driving the construction of FTTR networks while expanding its product line of mixed-signal conversion chips. This will provide more technical support for the development of various industries and contribute to the digital transformation of society.

This new generation of voice chips has already achieved mass production with several well-known domestic manufacturers. Sais Electronics will continue to innovate and accumulate technology, injecting new vitality into the development of the telecommunications industry.