What is the Additional Feature ?

Name: STM32L471RGT6TR
Brand: STMicroelectronics
SKU: STM32L471RGT6TR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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STMicroelectronics STM32L471RGT6TR

Part No.:: STM32L471RGT6TR

Manufacturer:: STMicroelectronics

Package:: 64-LQFP

Datasheet:: STM32L471RGT6TR.pdf

Description:: IC MCU 32BIT 1MB FLASH 64LQFP

In Stock:: 2741

Quantity:: Add To Cart

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STM32L471RGT6TR Specifications

Package/Case:
64-LQFP
Packaging:
Tape & Reel (TR),Cut Tape (CT),Digi-Reel®
Series:
STM32L4
RoHS:
RoHS
Speed:
80MHz
RAM Size:
128K x 8
Core Size:
32-Bit
EEPROM Size:
-
Part Status:
Active
Peripherals:
Brown-out Detect/Reset, DMA, PWM, WDT
Connectivity:
CANbus, I²C, IrDA, LINbus, MMC/SD, QSPI, SAI, SPI, SWPMI, UART/USART
Mounting Type:
Surface Mount
Number of I/O:
51
Core Processor:
ARM® Cortex®-M4
Data Converters:
A/D 16x12b; D/A 2x12b
Oscillator Type:
Internal
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
Operating Temperature:
-40°C ~ 85°C (TA)

STM32L471RGT6TR this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including STM32L471RGT6TR price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for STM32L471RGT6TR to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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STM32L471RGT6TR information

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Common technical challenges and solutions when using STM32L471RGT6TR

STM32L471RGT6TR is a microcontroller known for its low power consumption and rich peripheral integration, commonly used in battery-powered and energy-efficient embedded systems.

Noise Challenges:

To address noise issues in STM32L471RGT6TR-based designs, follow these strategies:

1. Layout Optimization: Implement a careful PCB layout to minimize signal crosstalk and ground loops. Utilize separate ground planes for analog and digital sections to prevent noise coupling.

2. Filtering: Incorporate passive components like capacitors and ferrite beads to filter out high-frequency noise from power supplies and communication lines.

3. Shielding: Shield sensitive components and traces, especially those handling high-speed signals, to prevent electromagnetic interference (EMI) from affecting system performance.

Power Consumption:

To mitigate power consumption challenges in STM32L471RGT6TR-based applications, consider these approaches:

1. Low-Power Modes: Leverage the various low-power modes offered by the microcontroller to minimize energy consumption during idle or standby periods.

2. Peripheral Management: Disable unused peripherals and reduce clock frequencies of active peripherals to reduce overall power consumption without sacrificing functionality.

3. Efficient Firmware: Optimize firmware algorithms to minimize CPU wake-ups and idle processing, ensuring efficient utilization of resources and prolonged battery life.

Integration Complexity:

To manage integration complexity when using STM32L471RGT6TR, adhere to these guidelines:

1. Modular Design: Break down the system into smaller, manageable modules, each responsible for specific tasks. Utilize communication interfaces like SPI or I2C for inter-module communication to simplify integration.

2. Hardware Abstraction: Abstract hardware interactions using middleware or HAL (Hardware Abstraction Layer) libraries provided by the microcontroller manufacturer to streamline software development and reduce integration efforts.

3. Documentation: Maintain comprehensive documentation outlining the system architecture, hardware connections, and software interfaces to facilitate collaboration and troubleshooting during the integration phase.

Considerations:

When addressing STM32L471RGT6TR challenges, consider:

- Power Supply Stability: Ensure stable power sources and proper decoupling capacitors to maintain reliable operation, especially in battery-powered applications.

- Temperature Management: Implement thermal management techniques, such as heat sinks or fans, to prevent overheating and ensure long-term reliability of the microcontroller and surrounding components.

- Firmware Update Mechanism: Incorporate a secure and efficient firmware update mechanism to facilitate bug fixes, feature enhancements, and security patches throughout the product lifecycle.

STM32L471RGT6TR FAQ

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3. Are the STM32L471RGT6TR price and inventory displayed accurate?

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6. What is the process for return or replacement of STM32L471RGT6TR?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the STM32L471RGT6TR we delivered, we will accept the replacement or return of the STM32L471RGT6TR only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of STM32L471RGT6TR.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations