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Name: STM32G031F8P6
Brand: STMicroelectronics
SKU: STM32G031F8P6
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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STMicroelectronics STM32G031F8P6

Part No.:: STM32G031F8P6

Manufacturer:: STMicroelectronics

Package:: 20-TSSOP (0.173", 4.40mm Width)

Datasheet:: STM32G031F8P6.pdf

Description:: IC MCU 32BIT 64KB FLASH 20TSSOP

In Stock:: 2674

Quantity:: Add To Cart

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STM32G031F8P6 Specifications

Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Packaging:
Tube
Series:
STM32G0
RoHS:
RoHS
Speed:
64MHz
RAM Size:
8K x 8
Core Size:
32-Bit
EEPROM Size:
-
Part Status:
Active
Peripherals:
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Connectivity:
I²C, IrDA, LINbus, SPI, UART/USART
Mounting Type:
Surface Mount
Number of I/O:
18
Core Processor:
ARM® Cortex®-M0+
Data Converters:
A/D 17x12b
Oscillator Type:
Internal
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
Operating Temperature:
-40°C ~ 85°C (TA)

STM32G031F8P6 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including STM32G031F8P6 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for STM32G031F8P6 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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STM32G031F8P6 information

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STM32G031F8P6 Typical application Circuitry Schematics

Creating an application circuit for the STM32G031F8P6, which is part of the STM32G0 series featuring an ARM Cortex-M0+ core, generally involves configuring the essential components for power, clock, reset, boot, programming/debugging, and peripherals. A general strategy for building a simple application circuit for this MCU is provided below:

1. Power Source: - VDD: Connect to a 3.3V power source. - VSS: Connect to the ground plane. - Include 100nF ceramic decoupling capacitors close to the VDD pins and a 10µF bulk capacitor on the power supply line.

2. Clock Circuit: - Optionally, connect a crystal or ceramic resonator to PF0 (OSC_IN) and PF1 (OSC_OUT). - Ensure appropriate load capacitors are connected, as recommended by the crystal manufacturer.

3. Reset Circuit: - NRST: Connect a 10kΩ pull-up resistor to VDD. Optionally, include a reset button connected to GND and a capacitor for additional filtering.

4. Boot Configuration: - BOOT0: Set according to the desired boot space (Flash, System memory).

5. SWD Programming/Debugging Interface: - PA13 (SWDIO) and PA14 (SWCLK): Connect to the debugger/programmer. - Ensure debugger GND is connected to the MCU ground.

6. I/O Pins Configuration: - Configure I/O pins according to specific application requirements, observing the MCU's I/O current limits.

7. Analog Setup (if applicable): - Connect AVDD and AVSS, and ensure they are properly decoupled. - Optionally, an external voltage reference can be applied to VREF+.

8. Peripheral Setup: - Establish connections for peripheral interfaces (e.g., I2C, SPI, UART) as per your application needs.

9. Decoupling and Protection: - Employ ESD protection for I/O lines, especially those connected to external connectors. - Make sure the power supply pins are close to where the decoupling capacitors are located.

Additional Information: User Interfaces (): Connect LEDs, ensuring current-limiting resistors are in place, and configure buttons with pull-up/pull-down resistors, as per your application needs. - Firmware Development: Utilize STM32G031F8P6and STM32CubeMX for code development and initial code generation. Ensure MCU configurations in the software match physical circuit connections. - PCB Design: Implement sound PCB designing techniques with a focus on temperature management, power supply, and signal integrity. - Testing: Validate your design under different operating conditions to ensure reliability and stability. Conclusion: While this guide outlines the fundamental aspects for creating an application circuit for the STM32G031F8P6, always refer to the [STM32G031F8P6 datasheet and reference manual](https://www.st.com/en/microcontrollers-microprocessors/stm32g031f8.html) for detailed information and specific recommendations. Prototyping and rigorous testing under anticipated operating conditions are critical to verifying the functionality and robustness of your design before moving to production.

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6. What is the process for return or replacement of STM32G031F8P6?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the STM32G031F8P6 we delivered, we will accept the replacement or return of the STM32G031F8P6 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of STM32G031F8P6.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations