STM32F756BGT6

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STMicroelectronics STM32F756BGT6

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Part No.:
STM32F756BGT6
Manufacturer:
STMicroelectronics
Package:
208-LQFP
Datasheet:
STM32F756BGT6.pdf
Description:
IC MCU 32BIT 1MB FLASH 208LQFP
In Stock:
3760
Quantity:
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    STM32F756BGT6 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including STM32F756BGT6 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for STM32F756BGT6 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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    STM32F756BGT6 informationSTM32F756BGT6 information

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    STM32F756BGT6 Typical application Circuitry Schematics


    The STM32F756BGT6 is part of the STM32F7 series of high-performance microcontrollers from STMicroelectronics. Incorporating the ARM Cortex-M7 core, this microcontroller family is acknowledged for its robust processing capabilities, rich set of I/Os, and multifaceted peripheral features. Let's break down the naming convention and then proceed to discuss the general features and circuit design considerations.  

    STM32F756BGT6 Naming Convention: - STM32: Indicates the STM32 family of microcontrollers. - F7: Points to the high-performance series featuring the Cortex-M7 core. - 56: Specifies a certain sub-family with particular features. - B: Refers to the package type (for exact type, refer to the datasheet). - G: Signifies the amount of Flash memory (please verify exact size in the datasheet). - T6: Denotes temperature range and variant information.  General Features and Specifications: - Core: ARM Cortex-M7. - Max Clock Frequency: Up to 216 MHz (verify in the datasheet for exact specification). - Flash Memory: Defined by variant (refer to datasheet). - RAM: Size specified in the datasheet. - I/O Pins: Varied per package type. - Communication Interfaces: Such as I2C, USART, SPI, USB, etc. - Analog Modules: Including ADCs and DACs. - Power Supply: Typically between 1.7 V and 3.6 V.  Basic Circuit Design Elements:  

    1. Power Supply: - Appropriate voltage on VDD/VSS pins, with decoupling capacitors placed near the pins.  

    2. Clock Circuit: - Optional external oscillator and relevant capacitors based on accuracy requirements.  

    3. Reset Circuit: - A reset button connected to the NRST pin, typically with a pull-up resistor.  

    4. GPIO Configuration: - Adequate pull-up or pull-down resistors where necessary.  

    5. Debugging/Programming: - Accessibility to SWDIO and SWCLK pins for debugging and programming.  

    6. Boot Mode Configuration: - Set BOOT0/BOOT1 pins for your required boot memory space.  

    7. Peripherals: - Ensure circuits are built for employed peripherals while adhering to their operational specifications.  

    Design Tips: - EMC and EMI: Ensure adherence to EMC and EMI standards to prevent electromagnetic interference. - Heat Management: Adequate heat dissipation techniques to keep the MCU within operational temperature ranges. - Protection: Include over-voltage and ESD protection. - Signal Integrity: Maintain trace lengths and impedances for high-speed signals.  Potential Applications: - Industrial Controls: Especially in scenarios demanding high computational power. - Medical Instruments: Utilized in devices requiring robust I/O and computational capabilities. - Consumer Electronics: Including smart home devices and wearables. - Communication Devices: With potentially complex communication requirements.  Development Environment: - STM32F756BGT6: For initial setup of pinouts, peripherals, and middleware with code generation. - STM32F756BGT6: For development and debugging in STMicroelectronics' IDE. - HAL/LL Libraries: Simplifying peripheral initialization and control.  Note: Always refer to the STM32F756BGT6 datasheet and reference manual provided by STMicroelectronics for specific, detailed, and accurate information on specifications, configurations, and usage. Validating and testing the design under real-world conditions will help ensure stability and reliability in actual applications. Ensure to verify features like memory sizes, pinouts, and specific electrical characteristics from the official documentation, as these are vital for precise engineering designs.

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    6. What is the process for return or replacement of STM32F756BGT6?

    All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the STM32F756BGT6 we delivered, we will accept the replacement or return of the STM32F756BGT6 only when all of the below conditions are fulfilled:

    (1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

    (2)We are informed of the defect described above within 90 days after the delivery of STM32F756BGT6.

    (3)The PartNo is unused and only in the original unpacked packaging.

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    (1)Inform us within 90 days

    (2)Obtain Requesting Return Authorizations

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