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Name: S6E2GH6H0AGV2000A
Brand: Cypress Semiconductor Corp
SKU: S6E2GH6H0AGV2000A
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Cypress Semiconductor Corp S6E2GH6H0AGV2000A

Part No.:: S6E2GH6H0AGV2000A

Manufacturer:: Cypress Semiconductor Corp

Package:: 144-LQFP

Datasheet:: S6E2GH6H0AGV2000A.pdf

Description:: IC MCU 32BIT 512KB FLASH 144LQFP

In Stock:: 2194

Quantity:: Add To Cart

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S6E2GH6H0AGV2000A Specifications

Package/Case:
144-LQFP
Packaging:
Tray
Series:
FM4 S6E2GH
RoHS:
RoHS
Speed:
180MHz
RAM Size:
128K x 8
Core Size:
32-Bit
EEPROM Size:
-
Part Status:
Active
Peripherals:
DMA, I²S, LVD, POR, PWM, WDT
Connectivity:
CANbus, CSIO, EBI/EMI, I²C, LINbus, SD, SmartCard, SPI, UART/USART, USB
Mounting Type:
Surface Mount
Number of I/O:
121
Core Processor:
ARM® Cortex®-M4F
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
Operating Temperature:
-40°C ~ 125°C (TA)

S6E2GH6H0AGV2000A this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including S6E2GH6H0AGV2000A price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for S6E2GH6H0AGV2000A to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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S6E2GH6H0AGV2000A information

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Common technical challenges and solutions when using S6E2GH6H0AGV2000A

S6E2GH6H0AGV2000A is a microcontroller chip developed by Renesas Electronics, offering advanced features for embedded systems applications. However, its integration into designs may encounter several technical challenges that need to be addressed for optimal performance and reliability.

Noise Issues:

To mitigate noise problems associated with S6E2GH6H0AGV2000A, careful PCB layout design is crucial. Implementing proper ground and power plane separation, minimizing trace lengths, and using decoupling capacitors near the chip's power pins can help reduce noise coupling and ensure signal integrity.

Power Consumption:

Managing power consumption is essential for battery-powered and energy-efficient applications. Utilize low-power modes and peripheral shutdown features available in S6E2GH6H0AGV2000A to minimize power consumption during idle periods. Additionally, optimize firmware algorithms to reduce CPU wake-up frequency and peripheral usage, further extending battery life.

Integration Complexity:

Integrating S6E2GH6H0AGV2000A into complex embedded systems may pose challenges due to its rich feature set and peripheral options. Employ modular design techniques to break down the system into manageable components, each handled independently. Utilize hardware abstraction layers (HALs) and middleware libraries provided by Renesas to streamline development and ensure compatibility with S6E2GH6H0AGV2000A's peripherals.

Temperature Management:

Managing temperature is critical for maintaining S6E2GH6H0AGV2000A's performance and reliability. Implement thermal management techniques such as heatsinks, thermal vias, and airflow design in the PCB layout to dissipate heat efficiently. Monitor chip temperature using internal temperature sensors and adjust system operation dynamically to prevent overheating.

Peripheral Interfacing:

Interfacing external peripherals with S6E2GH6H0AGV2000A requires careful attention to signal compatibility and timing requirements. Ensure proper voltage level translation and signal conditioning between the microcontroller and external devices. Follow Renesas' recommended guidelines for interfacing with common peripherals such as sensors, displays, and communication modules to minimize integration issues.

Conclusion:

Incorporating S6E2GH6H0AGV2000A microcontroller into embedded designs offers numerous benefits but requires addressing various technical challenges effectively. By implementing appropriate design practices, optimizing firmware algorithms, and leveraging available resources, designers can overcome these challenges and develop robust and efficient embedded systems.

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6. What is the process for return or replacement of S6E2GH6H0AGV2000A?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of S6E2GH6H0AGV2000A.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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