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Name: S29GL01GS10DHI010
Brand: Cypress Semiconductor Corp
SKU: S29GL01GS10DHI010
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Cypress Semiconductor Corp S29GL01GS10DHI010

Part No.:: S29GL01GS10DHI010

Manufacturer:: Cypress Semiconductor Corp

Package:: 64-LBGA

Datasheet:: S29GL01GS10DHI010.pdf

Description:: IC FLASH 1GBIT PARALLEL 64FBGA

In Stock:: 2695

Quantity:: Add To Cart

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S29GL01GS10DHI010 Specifications

Package/Case:
64-LBGA
Packaging:
Tray,Tray
Series:
GL-S
ProductStatus:
Active
MemoryType:
Non-Volatile
MemoryFormat:
FLASH
Technology:
FLASH - NOR
MemorySize:
1Gb (64M x 16)
MemoryInterface:
Parallel
ClockFrequency:
-
WriteCycleTime-WordPage:
60ns
AccessTime:
100 ns
Voltage-Supply:
2.7V ~ 3.6V
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

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S29GL01GS10DHI010 information

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S29GL01GS10DHI010 Typical application Circuitry

S29GL01GS10DHI010

With a 1 Gigabit (Gb) storage capacity, Cypress Semiconductor (now a part of Infineon Technologies) designed the S29GL01GS10DHI010 Parallel NOR Flash memory chip. It's part of the S29GL Series, known for its high performance, reliability, and endurance. This chip is tailored for applications that demand substantial, fast, and reliable non-volatile storage.

Functionality & Application Scenarios

- Embedded Systems: Ideal for storing bootloaders, firmware, and application code.

- Automotive Electronics: For firmware storage in advanced driver-assistance systems (ADAS), infotainment systems, and ECUs.

- Industrial Controls: For program storage and configuration data in automation systems.

- Telecommunications Equipment: In network routers and switches for firmware and configuration storage.

- Consumer Electronics: For portable media players, game consoles, and digital cameras' firmware storage.

Important characteristics and parameters of the S29GL01GS10DHI010

-1Gb storage capacity: gives enough room for sophisticated applications and large data storage requirements.

- Parallel Interface: Supports high-speed data and address bus communication.

- High-Speed Read Performance: Facilitates quick access to data, enhancing device responsiveness.

- Sector Erase & Program Functions: Enables efficient data management and firmware updates.

- Broad operating temperature range: Provides dependable performance in a range of environmental circumstances.

Detailed Application Scenario: Firmware Storage in Automotive Electronics

Circuit Connection Detail of S29GL01GS10DHI010

Incorporating the S29GL01GS10DHI010 into an automotive electronics system for firmware storage requires detailed attention to the memory interface, power supply design, and data integrity to ensure optimal performance and reliability.

1. Parallel Interface Connection

Connect the Address (A[0:n]) and Data (D[0:n]) buses between the S29GL01GS10DHI010 and the automotive system's microcontroller or processor. In order to enable communication, this entails wiring control signals like Chip Enable (CE#), Write Enable (WE#), and Output Enable (OE#). Ensuring short, impedance-controlled traces and appropriate bus termination are essential for maintaining signal integrity and reliability in high-speed operations.

2. Power Supply Design

Supply stable power to the VCC pin and ensure a good ground connection to VSS. Decoupling capacitors should be placed close to these pins to filter out voltage spikes and noise, promoting stable operation. Monitoring power supply stability is critical to avoid data corruption and ensure reliable memory operation.

3. Write Protection Mechanism

Implement hardware-based write protection by utilizing the Write Protect (WP#) pin, if available. This feature can prevent unintended write operations or data corruption, enhancing the system's reliability. A pull-up or pull-down resistor on the WP# pin can be used to set the default state of write protection according to system requirements.

4. System Design Considerations

Carefully design the address and data buses to ensure reliable communication between the memory chip and the microcontroller. This includes considering trace length matching, cross-talk minimization, and proper bus termination to avoid signal reflection and integrity issues.

Design Considerations

- Data Integrity: Implement error-checking and correction mechanisms to safeguard the integrity of stored data, especially in critical automotive applications.

- Thermal Management: Consider the thermal aspects of the memory chip, especially when operated at high frequencies or in high-temperature environments.

- Boot Process Efficiency: Optimize the boot process to efficiently utilize the NOR Flash's fast read capabilities for quick system startup.

- Power Management: Optimize the power supply design for low power consumption, considering the memory's active, standby, and deep power-down modes.

- PCB Layout: Carefully plan the PCB layout to minimize electromagnetic interference (EMI) and ensure signal integrity, focusing on the parallel interface's integrity and power supply decoupling.

Integrating the S29GL01GS10DHI010 into an automotive electronics system for firmware storage highlights the NOR Flash memory's capacity to support high-reliability, high-performance applications. Addressing the key design considerations ensures a successful integration, leveraging the advanced features of this Parallel NOR Flash memory chip to enhance system performance and reliability.

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6. What is the process for return or replacement of S29GL01GS10DHI010?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of S29GL01GS10DHI010.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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