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Name: S29GL01GP11FFIR10
Brand: Cypress Semiconductor Corp
SKU: S29GL01GP11FFIR10
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Cypress Semiconductor Corp S29GL01GP11FFIR10

Part No.:: S29GL01GP11FFIR10

Manufacturer:: Cypress Semiconductor Corp

Package:: 64-LBGA

Datasheet:: S29GL01GP11FFIR10.pdf

Description:: IC FLASH 1GBIT PARALLEL 64BGA

In Stock:: 2908

Quantity:: Add To Cart

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S29GL01GP11FFIR10 Specifications

Package/Case:
64-LBGA
Packaging:
Tray
Series:
GL-P
ProductStatus:
Obsolete
MemoryType:
Non-Volatile
MemoryFormat:
FLASH
Technology:
FLASH - NOR
MemorySize:
1Gb (128M x 8)
MemoryInterface:
Parallel
ClockFrequency:
-
WriteCycleTime-WordPage:
110ns
AccessTime:
110 ns
Voltage-Supply:
3V ~ 3.6V
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

S29GL01GP11FFIR10 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including S29GL01GP11FFIR10 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for S29GL01GP11FFIR10 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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S29GL01GP11FFIR10 information

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S29GL01GP11FFIR10 Typical application Circuitry

S29GL01GP11FFIR10

The S29GL01GP11FFIR10 is a Parallel NOR Flash memory chip designed for high-speed, high-density storage solutions. Part of the S29GL-P series from Cypress Semiconductor (now part of Infineon Technologies), this chip offers a storage capacity of 1 Gigabit (Gb) and is designed using the NOR architecture for fast read speeds and reliable data storage. It's particularly well-suited for applications requiring large, non-volatile storage with quick access times, such as embedded systems, automotive electronics, industrial control systems, telecommunications equipment, and consumer electronics.

Functionality & Application Scenarios

- Embedded Systems: Ideal for storing firmware, bootloaders, and application software that require fast access.

- Automotive Electronics: Used in ECU programming, infotainment systems, and advanced driver assistance systems (ADAS) for firmware storage.

- Industrial Controls: For program storage and configuration data in automation equipment and sensors.

- Telecommunications Equipment: In routers and switches for firmware storage and configuration settings.

- Consumer Electronics: For firmware storage in devices such as digital cameras and portable media players.

Key Parameters & Features

- 1Gb Storage Capacity: Provides extensive space for data and program storage.

- Parallel Interface: Supports fast data and address bus communication for high-speed read and write operations.

- High Reliability: Offers robust data retention and endurance characteristics.

- Sector Erase & Program: Allows for flexible and efficient data management.

- Wide Operating Temperature Range: Ensures reliable operation under various environmental conditions.

Detailed Application Scenario: Firmware Storage in Embedded Systems

Circuit Connection Detail

Incorporating the S29GL01GP11FFIR10 into an embedded system for firmware storage requires careful attention to the memory interface and power supply design to optimize performance and reliability.

1. Parallel Interface Connection

Interface the embedded system's microcontroller or processor with the S29GL01GP11FFIR10's parallel pins. This includes connecting the Address (A[0:n]) and Data (D[0:n]) buses between the memory chip and the microcontroller, as well as control signals such as Chip Enable (CE#), Write Enable (WE#), and Output Enable (OE#). Short, impedance-controlled traces and bus termination might be necessary to maintain signal integrity, especially for high-speed operations.

2. Power Supply Design

Supply stable power to the S29GL01GP11FFIR10 VCC pin and ensure a good ground connection to VSS. Employing decoupling capacitors near the power supply pins is crucial for minimizing noise, promoting stable memory operation. The use of bulk capacitors might also be considered to stabilize the power supply further.

3. Write Protection Mechanism

Implement hardware-based write protection by utilizing the Write Protect (WP#) pin, if available. This feature can prevent unintended write operations or data corruption, enhancing the system's reliability. A pull-up or pull-down resistor on the WP# pin can be used to set the default state of write protection according to system requirements.

4. Address and Data Bus Design

Carefully design the address and data buses to ensure reliable communication between the memory chip and the microcontroller. This includes considering trace length matching, cross-talk minimization, and proper bus termination to avoid signal reflection and integrity issues.

Design Considerations

- Data Integrity: Implement error-checking and correction mechanisms to safeguard the integrity of stored data, especially in critical applications.

- Thermal Management: Account for heat generation and dissipation in the system design, especially when the memory chip is operated at high frequencies or in high-temperature environments.

- System Boot Process: Design the boot process to efficiently utilize the fast read capabilities of the NOR Flash for quick system startup.

- Power Management: Optimize the S29GL01GP11FFIR10 power supply design for low power consumption, considering the memory's active, standby, and deep power-down modes.

- PCB Layout: Minimize electromagnetic interference (EMI) and ensure signal integrity through careful PCB layout planning, focusing on the parallel interface's integrity and power supply stability.

Incorporating the S29GL01GP11FFIR10 into an embedded system for firmware storage showcases the chip's capability to provide large, fast-access non-volatile storage, enhancing the system's performance and reliability. Addressing the outlined design considerations ensures a successful integration, leveraging the advanced features of this Parallel NOR Flash memory chip.

S29GL01GP11FFIR10 FAQ

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6. What is the process for return or replacement of S29GL01GP11FFIR10?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the S29GL01GP11FFIR10 we delivered, we will accept the replacement or return of the S29GL01GP11FFIR10 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of S29GL01GP11FFIR10.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations