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Name: PC28F256P30BFE
Brand: Alliance Memory, Inc.
SKU: PC28F256P30BFE
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Alliance Memory, Inc. PC28F256P30BFE

Part No.:: PC28F256P30BFE

Manufacturer:: Alliance Memory, Inc.

Package:

Datasheet:: PC28F256P30BFE.pdf

Description:: FLASH - NOR (MLC) Memory IC 256Mbit CFI 52 MHz 100 ns 64-EasyBGA (10x13)

In Stock:: 9999

Quantity:: Add To Cart

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PC28F256P30BFE Specifications

Package/Case:
Packaging:
64-EasyBGA (10x13)
Series:
ProductStatus:
MemoryType:
MemoryFormat:
Technology:
MemorySize:
MemoryInterface:
ClockFrequency:
WriteCycleTime-WordPage:
AccessTime:
Voltage-Supply:
OperatingTemperature:
MountingType:

PC28F256P30BFE this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including PC28F256P30BFE price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for PC28F256P30BFE to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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PC28F256P30BFE information

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PC28F256P30BFE Typical application Circuitry

PC28F256P30BFE

The PC28F256P30BFE is a high-density, high-performance parallel NAND Flash memory chip. This chip is widely used in a variety of applications where large storage capacity and fast access to non-volatile memory are required, such as in embedded systems, solid-state drives (SSDs), automotive applications, and industrial automation systems.

Key Features of PC28F256P30BFE:

1. Large Storage Capacity: Offers a significant amount of non-volatile storage, typically 256Mb.

2. High-Performance Interface: Provides a parallel interface for fast data transfer rates.

3. Robust Data Retention: Ensures data is preserved effectively even without power.

4. High Endurance: Capable of withstanding a large number of write cycles, making it reliable for frequent data writes.

Application Scenario - Embedded System Storage:

The PC28F256P30BFE is ideal for use in embedded systems, providing reliable and high-speed storage for firmware, application code, and user data.

Circuit Design Details:

1. Power Supply Connection: Connect the Vcc pin (typically pin 48) to a stable 3.3V power supply, as required by most embedded systems.

2. Ground Connection: The Vss pin (typically pin 24) should be connected to the system ground.

3. Data Interface: Interface the data pins (D0 to D7, pins 39 to 46) with the corresponding data bus of the embedded system's microcontroller or processor.

4. Control Pins: The chip enable (CE#, pin 30), write enable (WE#, pin 29), and read enable (RE#, pin 31) pins must be connected to the control lines of the microcontroller or processor for proper operation.

5. Address Interface: Connect the address pins (A0 to A14, various pins) to the address bus of the microcontroller or processor to access different memory locations.

6. Ready/Busy Pin: The R/B# pin (pin 32) can be used to detect the memory status and is especially useful in managing read/write operations efficiently.

Design Considerations with PC28F256P30BFE:

- Stable Power Source: Essential for reliable memory operation and data integrity.

- Data Bus Compatibility: Ensure the data bus of the microcontroller or processor is compatible with the parallel interface of the NAND Flash memory.

- Timing Constraints: Adhere to the timing requirements for read/write operations as specified in the datasheet.

- PCB Layout: Optimize the PCB layout for signal integrity, especially when dealing with high-speed data transfers.

In summary, the PC28F256P30BFE NAND Flash memory chip is well-suited for embedded system storage, providing a large storage capacity, high-performance parallel interface, robust data retention, and high endurance. Designing circuits with the PC28F256P30BFE should focus on ensuring a stable power supply, data bus compatibility, adherence to timing constraints, and optimizing the PCB layout for effective memory operation and data integrity in embedded system applications.

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6. What is the process for return or replacement of PC28F256P30BFE?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the PC28F256P30BFE we delivered, we will accept the replacement or return of the PC28F256P30BFE only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of PC28F256P30BFE.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations