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Name: MX30LF2G18AC-TI
Brand: Macronix
SKU: MX30LF2G18AC-TI
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Macronix MX30LF2G18AC-TI

Part No.:: MX30LF2G18AC-TI

Manufacturer:: Macronix

Package:: 48-TFSOP (0.724, 18.40mm Width)

Datasheet:: MX30LF2G18AC-TI.pdf

Description:: IC FLASH 2GBIT PARALLEL 48TSOP

In Stock:: 2138

Quantity:: Add To Cart

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MX30LF2G18AC-TI Specifications

Package/Case:
48-TFSOP (0.724, 18.40mm Width)
Packaging:
Tray
Series:
MX30LF
ProductStatus:
Not For New Designs
MemoryType:
Non-Volatile
MemoryFormat:
FLASH
Technology:
FLASH - NAND (SLC)
MemorySize:
2Gb (256M x 8)
MemoryInterface:
Parallel
ClockFrequency:
-
WriteCycleTime-WordPage:
20ns
AccessTime:
20 ns
Voltage-Supply:
2.7V ~ 3.6V
OperatingTemperature:
-40°C ~ 85°C (TA)
MountingType:
Surface Mount

MX30LF2G18AC-TI this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including MX30LF2G18AC-TI price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for MX30LF2G18AC-TI to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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MX30LF2G18AC-TI information

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MX30LF2G18AC-TI Typical application Circuitry

MX30LF2G18AC-TI

MX30LF2G18AC-TI is a NAND Flash memory device designed for a wide range of digital storage applications. It offers a large storage capacity and is suitable for use in embedded systems, consumer electronics, and storage devices where high-density, non-volatile memory is required.

Application Scenario: Embedded System Storage

The MX30LF2G18AC-TI is ideal for embedded systems, such as IoT devices, industrial controllers, and automotive electronics, which require reliable and durable storage for firmware, application code, and data logging.

Parameter Features

- Storage Capacity: 2 Gbit, providing ample space for complex applications and data storage needs.

- Interface: Parallel interface that works with a variety of microcontrollers and CPUs to provide fast data transfer.

- Supply Voltage: Typically operates at 3.3V, suitable for most embedded system power supplies.

- Package: Available in a TSOP or similar package, facilitating easy integration into PCB designs.

Detailed Circuit Connection for an Embedded System

1.Power Supply Connections

- VCC to Power Source: Connect the VCC pins to a regulated 3.3V power supply, ensuring stable operation of the NAND Flash memory.

- Decoupling Capacitors: To reduce noise and offer a steady power source, place decoupling capacitors next to the VCC pins.

2.Data and Control Interface

- Data I/O Pins to Microcontroller: Connect the data I/O pins of the MX30LF2G18AC-TI to the corresponding data ports on the microcontroller for data read/write operations.

- Control Signals (WE, RE, CE, ALE, CLE): Connect the write enable (WE), read enable (RE), chip enable (CE), address latch enable (ALE), and command latch enable (CLE) pins to the microcontroller's GPIO pins to control the NAND Flash operations.

3.Grounding

- GND Pins to System Ground: Ensure all GND pins are connected to the system's ground plane for stable operation and noise reduction.

4.Address and Command Setup

- Address Pins to Microcontroller: Connect the address pins to the microcontroller to select specific memory locations for read/write operations.

- Command Interface: Use the microcontroller to send appropriate commands to the CLE (Command Latch Enable) pin to perform various operations like page read, page write, block erase, etc.

Design Considerations

- Signal Integrity: Ensure the integrity of data, address, and control signals, especially in environments with high electromagnetic interference (EMI). Use proper routing, termination, and shielding techniques.

- Power Stability: Provide a clean and stable power supply to the MX30LF2G18AC-TI with adequate decoupling and, if necessary, power filtering components to prevent data corruption.

- Thermal Management: Consider the thermal aspects of the NAND Flash, especially in applications with high write/read cycles or elevated ambient temperatures, to ensure reliability and longevity.

- Firmware and Error Handling: Implement robust firmware with error correction code (ECC) capabilities to manage potential data errors and ensure data integrity in the NAND Flash.

By carefully integrating the MX30LF2G18AC-TI into the design of embedded systems, developers can leverage its high storage capacity and reliability to enhance the functionality and performance of a wide range of applications.

MX30LF2G18AC-TI FAQ

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3. Are the MX30LF2G18AC-TI price and inventory displayed accurate?

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6. What is the process for return or replacement of MX30LF2G18AC-TI?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the MX30LF2G18AC-TI we delivered, we will accept the replacement or return of the MX30LF2G18AC-TI only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of MX30LF2G18AC-TI.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations