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Name: MT9M001C12STMH-GEVB
Brand: ON Semiconductor
SKU: MT9M001C12STMH-GEVB
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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ON Semiconductor MT9M001C12STMH-GEVB

Part No.:: MT9M001C12STMH-GEVB

Manufacturer:: ON Semiconductor

Package:

Datasheet:: MT9M001C12STMH-GEVB.pdf

Description:: BOARD EVAL 1 MP 1/4.5 CIS HB

In Stock:: 2145

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MT9M001C12STMH-GEVB Specifications

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MT9M001C12STMH-GEVB information

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MT9M001C12STMH-GEVB Typical application Circuitry

The MT9M001C12STMH-GEVB is a mockup of a CMOS image sensor development board designed to facilitate the evaluation and prototyping of imaging solutions using the MT9M001 or similar image sensors. Such development boards are an integral part of the design, test and development phases of imaging systems, providing engineers with a platform to evaluate sensor functionality and experiment with different configurations.

Functionalities of MT9M001C12STMH-GEVB

1. High-Resolution Image Capture: The board is designed to work with high-resolution image sensors, providing clear and detailed images.

2. Ease of Integration: Typically features standard interfaces, making it easy to integrate with a variety of systems and microcontrollers.

3. Development and Testing: Offers a platform for the development and testing of image processing algorithms and system configurations.

4. Customization and Flexibility: Allows for adjustments and modifications to meet specific application needs, facilitating a flexible design process.

Application Scenario: Prototype Development for Security Cameras

The MT9M001C12STMH-GEVB is ideal for the prototype development of advanced security cameras, where high-resolution image capture is crucial for detailed surveillance and identification purposes.

Detailed Circuit Connection Guide

Integrating the MT9M001C12STMH-GEVB into a Security Camera Prototype:

1. Power Supply Connections:

- Stable Power Source: Connect the power supply pins (often labeled as VDD or similar) of the MT9M001C12STMH-GEVB to a stable power source, ensuring the voltage is within the board's operational range.

- Grounding for Stability: Link the ground (GND) pins of the MT9M001C12STMH-GEVB to the system's ground to provide a stable reference and minimize noise.

2. Image Sensor Interface:

- Sensor Data Outputs: Connect the image sensor's data output pins on the MT9M001C12STMH-GEVB to the corresponding input pins on the image processing unit or microcontroller, ensuring efficient transfer of image data.

3. Control and Configuration Interface:

- System Control Integration: Interface the control pins (which may include FSYNC, SHUTTER, and others) to the main control unit of the security camera system for precise control over image capture timing and synchronization.

- Sensor Configuration: Utilize the configuration interface (likely I2C or SPI) to set up the image sensor's operational parameters and make real-time adjustments as required by the security system's logic.

Circuit Design Considerations

When working with the MT9M001C12STMH-GEVB in your design, consider the following:

1. Power Supply Integrity: Ensure a clean and stable power supply to maintain image quality and prevent sensor or board malfunctions.

2. Signal Integrity for Image Data: Preserve the integrity of the high-speed image data signals to ensure accurate and reliable image capture.

3. Thermal Management: Implement appropriate solutions for managing the heat generated by the board and the sensor, especially if the security camera is intended for outdoor or enclosed use.

4. Mechanical Stability and Protection: Ensure that the MT9M001C12STMH-GEVB and the associated sensor are securely mounted and protected from environmental factors like vibrations, dust, and moisture.

In conclusion, the MT9M001C12STMH-GEVB is an excellent platform for the development and prototyping of high-resolution imaging systems, such as advanced security cameras. Careful attention to the connection guide and consideration of the design principles will ensure a successful and reliable application of the MT9M001C12STMH-GEVB in your imaging project.

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6. What is the process for return or replacement of MT9M001C12STMH-GEVB?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

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