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Name: MC9S12DG256MPVE
Brand: NXP USA Inc.
SKU: MC9S12DG256MPVE
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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NXP USA Inc. MC9S12DG256MPVE

Part No.:: MC9S12DG256MPVE

Manufacturer:: NXP USA Inc.

Package:: 112-LQFP

Datasheet:: MC9S12DG256MPVE.pdf

Description:: IC MCU 16BIT 256KB FLASH 112LQFP

In Stock:: 3960

Quantity:: Add To Cart

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MC9S12DG256MPVE Specifications

Package/Case:
112-LQFP
Packaging:
Tray
Series:
HCS12
RoHS:
RoHS
Speed:
25MHz
RAM Size:
12K x 8
Core Size:
16-Bit
EEPROM Size:
4K x 8
Part Status:
Active
Peripherals:
PWM, WDT
Connectivity:
CANbus, I²C, SCI, SPI
Mounting Type:
Surface Mount
Number of I/O:
91
Core Processor:
HCS12
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
Operating Temperature:
-40°C ~ 125°C (TA)

MC9S12DG256MPVE this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including MC9S12DG256MPVE price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for MC9S12DG256MPVE to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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MC9S12DG256MPVE information

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MC9S12DG256MPVE Application Introduction

MC9S12DG256MPVE is a microcontroller chip known for its versatility and performance, commonly utilized in embedded systems for diverse applications.

Application Scenario:

In automotive electronics, MC9S12DG256MPVE can be employed to control various vehicle functions, such as engine management and chassis control systems.

Circuit Design:

To design a vehicle control system using MC9S12DG256MPVE, follow these steps:

1. Power Supply Management:

Ensure proper power supply design, including voltage regulation and filtering, to provide stable voltage levels to MC9S12DG256MPVE and associated components. Incorporate voltage regulators and decoupling capacitors to minimize noise and ensure reliable operation.

2. Signal Integrity:

Design the circuit layout carefully to minimize signal noise and interference, especially in high-frequency or analog signal paths. Use proper grounding techniques and signal isolation where necessary to maintain signal integrity.

3. Thermal Management:

Implement effective thermal management techniques to ensure MC9S12DG256MPVE operates within its specified temperature range. Use heat sinks, thermal vias, and adequate ventilation in the system enclosure to dissipate heat generated during operation.

4. Peripheral Interface:

Utilize the rich peripheral set of MC9S12DG256MPVE for interfacing with various vehicle sensors and actuators. Configure GPIO pins, SPI, I2C, and CAN interfaces as needed to communicate with external devices and subsystems.

5. EMC/EMI Compliance:

Design the circuit layout and enclosure shielding to minimize electromagnetic interference and ensure compliance with automotive EMC/EMI standards. Proper grounding, shielding, and filtering techniques are essential to prevent interference with other vehicle electronics and radio frequencies.

Considerations:

When designing with MC9S12DG256MPVE, consider the following:

- Real-Time Performance: Optimize firmware algorithms for real-time responsiveness and efficient execution on the MC9S12DG256MPVE platform.

- System Reliability: Conduct thorough testing and validation to ensure the system meets reliability and safety requirements, especially in critical automotive applications.

- Power Efficiency: Implement power-saving techniques, such as low-power modes and peripheral shutdown, to minimize energy consumption and extend battery life in battery-operated systems.

- Component Selection: Choose components rated for automotive-grade reliability and durability to withstand harsh operating conditions and ensure long-term performance.

- Firmware Updates: Plan for firmware update mechanisms to allow for future enhancements and bug fixes, ensuring the system remains up-to-date and adaptable to evolving requirements.

MC9S12DG256MPVE FAQ

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3. Are the MC9S12DG256MPVE price and inventory displayed accurate?

The price and inventory of MC9S12DG256MPVE fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of MC9S12DG256MPVE?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the MC9S12DG256MPVE we delivered, we will accept the replacement or return of the MC9S12DG256MPVE only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of MC9S12DG256MPVE.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations