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Name: MC88LV926EGR2
Brand: Renesas Electronics America Inc
SKU: MC88LV926EGR2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Renesas Electronics America Inc MC88LV926EGR2

Part No.:: MC88LV926EGR2

Manufacturer:: Renesas Electronics America Inc

Package:: 20-SOIC (0.295, 7.50mm Width)

Datasheet:: MC88LV926EGR2.pdf

Description:: IC CLK BUF CISC 66MHZ 1CIRC

In Stock:: 3148

Quantity:: Add To Cart

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MC88LV926EGR2 Specifications

Packaging:
Tape & Reel (TR)
Series:
-
Product Status:
Obsolete
PLL:
Yes
Main Purpose:
CISC/RISC Microprocessor
Input:
CMOS, TTL
Output:
CMOS
Number of Circuits:
1
Ratio-Input:Output:
1:6
Differential-Input:Output:
No/No
Frequency-Max:
66MHz
Voltage-Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount

MC88LV926EGR2 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including MC88LV926EGR2 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for MC88LV926EGR2 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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MC88LV926EGR2 information

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MC88LV926EGR2 Application Introduction

MC88LV926EGR2 is a high-speed LVDS (Low-Voltage Differential Signaling) repeater specifically designed for demanding applications in data communication and signal transmission.

Application Overview:

In high-speed data transmission systems, MC88LV926EGR2 can be effectively utilized to extend the reach of LVDS signals, ensuring signal integrity and reliability over long distances.

Design Considerations:

To optimize the design and performance when using MC88LV926EGR2, consider the following aspects:

1. Power Management:

Implement robust power management techniques to ensure stable voltage levels for MC88LV926EGR2 operation. Utilize low-dropout voltage regulators and proper decoupling capacitors to minimize noise and voltage fluctuations.

2. Signal Integrity:

Pay special attention to signal integrity during PCB layout and routing. Minimize signal reflections, crosstalk, and impedance mismatches to maintain signal quality and reliability. Use controlled impedance traces for LVDS signal paths.

3. Thermal Management:

Manage heat dissipation effectively to prevent overheating and ensure MC88LV926EGR2 operates within its specified temperature range. Use thermal vias, heat sinks, or thermal pads for efficient heat transfer and thermal dissipation.

4. Layout Considerations:

Follow best practices for PCB layout to minimize noise and interference. Keep high-speed traces short and direct, reduce signal loop area, and separate sensitive analog and digital sections to prevent signal degradation.

5. EMI/EMC Compliance:

Design the circuit layout and enclosure to comply with electromagnetic interference (EMI) and electromagnetic compatibility (EMC) standards. Shield sensitive components, use ground planes effectively, and employ EMI filters if necessary.

Optimization Techniques:

To enhance the performance and reliability of the design, consider the following optimization techniques:

- Use LVDS terminations to match impedance and minimize reflections at the input and output ports of MC88LV926EGR2.

- Employ differential signaling for noise immunity and higher data rates, exploiting the benefits of LVDS technology.

- Perform thorough signal integrity simulations and testing to validate the design and ensure reliable operation under various operating conditions.

- Implement built-in self-test (BIST) features of MC88LV926EGR2 for diagnostic purposes and fault detection during operation.

Conclusion:

Effective utilization of MC88LV926EGR2 in design projects requires careful attention to power management, signal integrity, thermal management, layout considerations, and EMI/EMC compliance. By implementing optimization techniques and best practices, designers can achieve optimal performance and reliability in high-speed data transmission systems.

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6. What is the process for return or replacement of MC88LV926EGR2?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the MC88LV926EGR2 we delivered, we will accept the replacement or return of the MC88LV926EGR2 only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of MC88LV926EGR2.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations