EMMC32G-TX29-8AD11 this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including EMMC32G-TX29-8AD11 price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for EMMC32G-TX29-8AD11 to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.
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Key Features and Specifications:
- Capacity: 32GB of NAND flash storage, providing ample space for operating systems, applications, and data storage.
- Surface: satisfies the most recent eMMC standard and provides fast data transfer speeds..
- Form Factor: Comes in a compact package that is suitable for embedded applications.
- Reliability: Enhanced for endurance and reliability in various environments, suitable for both consumer and industrial usage.
- Speed Class: Supports fast read and write speeds, essential for high-performance devices.
Application Scenario: Smartphone Storage System
In a smartphone, the EMMC32G-TX29-8AD11 serves as the primary storage component, hosting the operating system, applications, and user data.
Circuit Design Methodology:
1. Power Supply Connection (VCC, VCCQ):
- VCC (Main Power Supply): Connect the VCC pin to a stable 3.3V power source. Ensure that the power supply can deliver adequate current for operation. Place a low-ESR capacitor close to the power pin to stabilize the voltage and filter high-frequency noise.
- VCCQ (I/O Power Supply): Connect VCCQ to a 1.8V or 3.3V source depending on the I/O voltage level required by the host interface. This pin powers the I/O buffers of the eMMC.
2. Data and Control Interface (DAT0-DAT7, CMD, CLK):
- DAT0-DAT7 (Data Lines): Connect these to the host microcontroller or processor. Use controlled impedance traces to maintain signal integrity, particularly at higher data rates.
- CMD (Command Line): This pin is used for sending commands to the eMMC. Like the data lines, it should be properly terminated and shielded to avoid noise.
- CLK (Clock Line): Connect the clock line from the host to the eMMC. Ensure that the trace is as short as possible and shielded from high-frequency noise sources to maintain a clean clock signal.
3. Ground Connections (GND):
- GND: All ground pins should be connected to the system's ground plane. Use multiple vias to ensure a low-impedance path and to enhance the thermal and electrical performance.
4. Mounting and Mechanical Stability:
- Place the eMMC chip on the PCB with consideration for thermal expansion and mechanical stress, as improper mounting could lead to solder joint failures under thermal cycling or mechanical shock.
5. EMI Considerations:
- Implement EMI shielding techniques, especially if the eMMC is placed near RF modules or other high-frequency components. Use ground planes and shielding cans to minimize the risk of interference.
Design Considerations:
- Signal Integrity: Pay close attention to the layout of command, data, and clock lines to minimize cross-talk and ensure robust data transmission.
- Power Integrity: Ensure clean and stable power delivery to the eMMC device. Utilize decoupling capacitors at both the VCC and VCCQ pins to reduce voltage fluctuations and power noise.
- Thermal Management: Monitor and manage the heat generated by the eMMC, especially in high-performance applications or in compact device designs.
- Reliability: Consider the eMMC's endurance and operational temperature range, ensuring that the device operates within specified limits to maintain data integrity and longevity.
- Data Security: Implement necessary measures to protect sensitive data stored on the eMMC, including encryption and secure access protocols, particularly in applications handling personal or confidential information.
Using the EMMC32G-TX29-8AD11 in a smartphone showcases its capabilities as a reliable and high-capacity storage solution, facilitating smooth operation and a good user experience by ensuring fast access to data and applications. This setup underscores the importance of integrating solid-state storage technology into modern electronic devices for enhanced performance and efficiency.
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The price and inventory of EMMC32G-TX29-8AD11 fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.
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All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the EMMC32G-TX29-8AD11 we delivered, we will accept the replacement or return of the EMMC32G-TX29-8AD11 only when all of the below conditions are fulfilled:
(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.
(2)We are informed of the defect described above within 90 days after the delivery of EMMC32G-TX29-8AD11.
(3)The PartNo is unused and only in the original unpacked packaging.
Two processes to return the products:
(1)Inform us within 90 days
(2)Obtain Requesting Return Authorizations
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