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Name: DSPIC33FJ09GS302-E/MX
Brand: Microchip Technology
SKU: DSPIC33FJ09GS302-E/MX
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Microchip Technology DSPIC33FJ09GS302-E/MX

Part No.:: DSPIC33FJ09GS302-E/MX

Manufacturer:: Microchip Technology

Package:: 28-UQFN Exposed Pad

Datasheet:: DSPIC33FJ09GS302-E/MX.pdf

Description:: IC MCU 16BIT 9KB FLASH 28UQFN

In Stock:: 2144

Quantity:: Add To Cart

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DSPIC33FJ09GS302-E/MX Specifications

Package/Case:
28-UQFN Exposed Pad
Packaging:
Tube
Series:
Automotive, AEC-Q100, dsPIC™ 33F
RoHS:
RoHS
Speed:
40 MIPs
RAM Size:
1K x 8
Core Size:
16-Bit
EEPROM Size:
-
Part Status:
Active
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Connectivity:
I²C, IrDA, LINbus, SPI, UART/USART
Mounting Type:
Surface Mount
Number of I/O:
21
Core Processor:
dsPIC
Data Converters:
A/D 8x10b; D/A 2x10b
Oscillator Type:
Internal
Program Memory Size:
9KB (3K x 24)
Program Memory Type:
FLASH
Operating Temperature:
-40°C ~ 125°C (TA)

DSPIC33FJ09GS302-E/MX this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including DSPIC33FJ09GS302-E/MX price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for DSPIC33FJ09GS302-E/MX to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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DSPIC33FJ09GS302-E/MX information

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The working principle and core technical features of DSPIC33FJ09GS302-E/MX

DSPIC33FJ09GS302-E/MX is a high-performance digital signal controller (DSC) manufactured by Microchip Technology. It combines the features of a microcontroller with the processing power of a digital signal processor (DSP), making it ideal for applications requiring real-time signal processing and control.

Working Principle:

The DSPIC33FJ09GS302-E/MX operates on a modified Harvard architecture with separate program and data buses, allowing simultaneous access to instructions and data. It features a high-speed core running at up to 40 MIPS, with various peripherals such as ADCs, PWM modules, and communication interfaces.

Core Technologies:

- Enhanced CPU: The DSC core includes a high-performance 16-bit CPU with DSP instructions, providing efficient execution of complex mathematical algorithms.

- Peripheral Integration: DSPIC33FJ09GS302-E/MX integrates multiple peripherals, including analog-to-digital converters (ADCs), pulse-width modulation (PWM) modules, timers, and communication interfaces such as UART, SPI, and I2C.

- Motor Control PWM: The device features specialized PWM modules optimized for motor control applications, offering high resolution, advanced timing control, and fault protection mechanisms.

- Digital Signal Processing: With DSP instructions and hardware acceleration, DSPIC33FJ09GS302-E/MX excels in real-time signal processing tasks such as digital filtering, modulation/demodulation, and control algorithms.

Application Scenarios:

In motor control applications, DSPIC33FJ09GS302-E/MX demonstrates superior performance and efficiency. It can be used in:

- Brushless DC (BLDC) motor control for applications like electric vehicles, drones, and industrial automation.

- Permanent Magnet Synchronous Motor (PMSM) control in appliances, HVAC systems, and robotics.

- Stepper motor control for precision positioning in CNC machines, 3D printers, and robotic arms.

Technical Advantages:

- High Processing Power: The combination of a high-speed CPU and DSP instructions enables efficient execution of control algorithms, resulting in precise motor control and responsive system behavior.

- Peripheral Flexibility: Integrated peripherals such as ADCs and PWM modules offer versatile interfacing options, facilitating sensor integration, feedback control, and system monitoring.

- Low Latency Communication: Communication interfaces like UART, SPI, and CAN enable seamless integration with external devices, controllers, and networks, ensuring fast data exchange and real-time coordination.

- Code Efficiency: Optimized instruction set and hardware acceleration enhance code efficiency, reducing the computational burden and memory footprint of signal processing tasks.

Enhancing System Performance and Efficiency:

To maximize the performance and efficiency of systems utilizing DSPIC33FJ09GS302-E/MX, consider the following strategies:

- Algorithm Optimization: Develop efficient control algorithms tailored to the specific application requirements, leveraging the DSP capabilities of the device to minimize computational overhead.

- Hardware Integration: Integrate sensors, actuators, and feedback mechanisms directly with the DSC, utilizing its integrated peripherals to streamline system architecture and reduce latency.

- Power Management: Implement power-saving techniques such as sleep modes, dynamic voltage scaling, and clock gating to minimize energy consumption during idle periods and prolong battery life in portable applications.

- System-Level Design: Employ modular and scalable design approaches, utilizing software frameworks and hardware abstraction layers to facilitate code reuse, maintenance, and future expansion.

- Performance Tuning: Continuously monitor and optimize system performance through profiling, debugging, and fine-tuning of control parameters, ensuring optimal operation under varying load conditions and environmental factors.

DSPIC33FJ09GS302-E/MX FAQ

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6. What is the process for return or replacement of DSPIC33FJ09GS302-E/MX?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the DSPIC33FJ09GS302-E/MX we delivered, we will accept the replacement or return of the DSPIC33FJ09GS302-E/MX only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of DSPIC33FJ09GS302-E/MX.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations