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Name: DSPIC33EV256GM002-I/MM
Brand: Microchip Technology
SKU: DSPIC33EV256GM002-I/MM
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Microchip Technology DSPIC33EV256GM002-I/MM

Part No.:: DSPIC33EV256GM002-I/MM

Manufacturer:: Microchip Technology

Package:: 28-VQFN Exposed Pad

Datasheet:: DSPIC33EV256GM002-I/MM.pdf

Description:: IC MCU 16BIT 256KB FLASH 28QFN

In Stock:: 2684

Quantity:: Add To Cart

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DSPIC33EV256GM002-I/MM Specifications

Package/Case:
28-VQFN Exposed Pad
Packaging:
Tube
Series:
dsPIC™ 33EV, Functional Safety (FuSa)
RoHS:
RoHS
Speed:
70 MIPs
RAM Size:
16K x 8
Core Size:
16-Bit
EEPROM Size:
-
Part Status:
Active
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity:
I²C, IrDA, LINbus, SPI, UART/USART
Mounting Type:
Surface Mount
Number of I/O:
21
Core Processor:
dsPIC
Data Converters:
A/D 11x10/12b
Oscillator Type:
Internal
Program Memory Size:
256KB (85.5K x 24)
Program Memory Type:
FLASH
Operating Temperature:
-40°C ~ 85°C (TA)

DSPIC33EV256GM002-I/MM this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including DSPIC33EV256GM002-I/MM price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for DSPIC33EV256GM002-I/MM to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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DSPIC33EV256GM002-I/MM information

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The working principle and core technical features of DSPIC33EV256GM002-I/MM

DSPIC33EV256GM002-I/MM is a high-performance digital signal controller (DSC) manufactured by Microchip Technology. It integrates advanced features tailored for demanding real-time control applications, offering enhanced processing capabilities and flexibility.

Working Principle:

The DSPIC33EV256GM002-I/MM employs a modified Harvard architecture with separate program and data buses, enabling simultaneous instruction fetching and data access. It incorporates a high-performance 16-bit DSP engine with a maximum instruction execution rate of up to 70 MIPS, facilitating rapid signal processing tasks.

Core Technology Features:

- Enhanced Direct Memory Access (DMA): Facilitates efficient data transfers between memory and peripherals, minimizing CPU intervention and enhancing overall system performance.

- Peripheral Pin Select (PPS): Allows flexible mapping of peripheral functions to physical pins, enabling customized I/O configurations tailored to specific application requirements.

- High-Speed Analog-to-Digital Converter (ADC): Integrates a high-resolution ADC with up to 1.1 MSPS sampling rate and multiple channels, enabling precise analog signal acquisition for sensor interfacing and feedback control.

- Digital Signal Processing (DSP) Engine: Equipped with specialized DSP instructions and hardware acceleration for arithmetic operations, enabling efficient implementation of complex algorithms such as filtering, modulation, and control.

- Dual Partition Flash Memory: Features dual partitions for program memory, allowing seamless firmware updates and reliable operation through partition redundancy and fail-safe mechanisms.

Application Effectiveness:

In motor control applications, DSPIC33EV256GM002-I/MM demonstrates superior performance by enabling precise control algorithms for motor speed, position, and torque. Its high-resolution ADC ensures accurate feedback sensing, while the DSP engine facilitates rapid computation of control signals, resulting in smooth and responsive motor operation.

In power electronics systems, the DSPIC33EV256GM002-I/MM enhances efficiency and reliability by implementing advanced control techniques such as predictive current control and space vector modulation. Its flexible peripheral configuration allows seamless integration with power devices such as MOSFETs and IGBTs, enabling precise regulation of voltage and current waveforms.

Enhancing System Performance and Efficiency:

- Multicore Architecture: Utilize multiple DSPIC33EV256GM002-I/MM devices in parallel or as coprocessors to distribute processing tasks and accelerate computation-intensive algorithms, enhancing overall system throughput and responsiveness.

- Hardware Acceleration: Leverage hardware features such as DMA and DSP engine to offload computational tasks from the CPU, reducing processing overhead and improving energy efficiency.

- Real-Time Optimization: Implement optimized firmware algorithms and scheduling techniques to minimize latency and maximize system responsiveness, ensuring timely execution of control tasks and meeting stringent real-time requirements.

- System-Level Integration: Integrate DSPIC33EV256GM002-I/MM with other Microchip devices and peripherals, such as power management ICs and communication modules, to create tightly integrated systems with seamless interoperability and reduced development complexity.

- Power Management: Employ advanced power management techniques, such as dynamic voltage and frequency scaling (DVFS) and low-power operating modes, to minimize energy consumption and extend battery life in portable and battery-powered applications.

DSPIC33EV256GM002-I/MM FAQ

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3. Are the DSPIC33EV256GM002-I/MM price and inventory displayed accurate?

The price and inventory of DSPIC33EV256GM002-I/MM fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

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6. What is the process for return or replacement of DSPIC33EV256GM002-I/MM?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the DSPIC33EV256GM002-I/MM we delivered, we will accept the replacement or return of the DSPIC33EV256GM002-I/MM only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of DSPIC33EV256GM002-I/MM.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations