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Name: DSPIC33EP512MC202-H/SP
Brand: Microchip Technology
SKU: DSPIC33EP512MC202-H/SP
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Microchip Technology DSPIC33EP512MC202-H/SP

Part No.:: DSPIC33EP512MC202-H/SP

Manufacturer:: Microchip Technology

Package:: 28-DIP (0.300", 7.62mm)

Datasheet:: DSPIC33EP512MC202-H/SP.pdf

Description:: IC MCU 16BIT 512KB FLASH 28SPDIP

In Stock:: 2233

Quantity:: Add To Cart

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DSPIC33EP512MC202-H/SP Specifications

Package/Case:
28-DIP (0.300", 7.62mm)
Packaging:
Tube
Series:
Automotive, AEC-Q100, dsPIC™ 33EP
RoHS:
RoHS
Speed:
60 MIPs
RAM Size:
24K x 16
Core Size:
16-Bit
EEPROM Size:
-
Part Status:
Active
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Connectivity:
I²C, IrDA, LINbus, QEI, SPI, UART/USART
Mounting Type:
Through Hole
Number of I/O:
21
Core Processor:
dsPIC
Data Converters:
A/D 6x10b/12b
Oscillator Type:
Internal
Program Memory Size:
512KB (170K x 24)
Program Memory Type:
FLASH
Operating Temperature:
-40°C ~ 150°C (TA)

DSPIC33EP512MC202-H/SP this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including DSPIC33EP512MC202-H/SP price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for DSPIC33EP512MC202-H/SP to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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DSPIC33EP512MC202-H/SP information

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The working principle and core technical features of DSPIC33EP512MC202-H/SP

DSPIC33EP512MC202-H/SP is a high-performance digital signal controller (DSC) manufactured by Microchip Technology, designed for demanding embedded control applications. It integrates advanced features and peripherals, making it suitable for a wide range of real-time control systems.

Working Principle:

The DSPIC33EP512MC202-H/SP operates on a modified Harvard architecture, combining the strengths of a traditional microcontroller with the computational power of a digital signal processor (DSP). It features a high-speed core running at up to 70 MIPS, with single-cycle multiply and accumulate (MAC) operations, enabling efficient execution of signal processing algorithms.

The core is complemented by a rich set of peripherals, including multiple high-resolution PWM modules, analog-to-digital converters (ADCs) with advanced sampling and triggering capabilities, and flexible communication interfaces such as UART, SPI, and I2C. These peripherals can be configured and synchronized to meet the requirements of diverse control tasks.

Core Technologies:

- High-Speed Core: The core of DSPIC33EP512MC202-H/SP operates at up to 70 MIPS, facilitating rapid execution of control algorithms and real-time processing of sensor data.

- Enhanced PWM: The device features multiple high-resolution PWM modules with advanced features like dead-time control, fault protection, and flexible duty cycle control, making it ideal for motor control and power conversion applications.

- Advanced ADCs: The integrated ADCs offer high resolution (up to 12 bits) and sampling rates, along with features like oversampling, averaging, and simultaneous sampling, ensuring accurate and reliable measurement of analog signals.

- Flexible Communication Interfaces: The device supports various communication protocols such as UART, SPI, and I2C, enabling seamless integration with other devices and communication with external systems.

Application Scenarios:

In motor control applications, DSPIC33EP512MC202-H/SP can be utilized to implement advanced control algorithms for precise speed and torque control in electric vehicles, industrial drives, and robotics.

In power electronics, the device can be employed in grid-tied inverters, uninterruptible power supplies (UPS), and renewable energy systems for efficient power conversion and grid synchronization.

In medical devices, DSPIC33EP512MC202-H/SP can be integrated into patient monitoring systems, ultrasound machines, and infusion pumps, enabling real-time signal processing and data acquisition with high accuracy and reliability.

Technological Advantages:

- High Computational Power: The combination of DSP and MCU capabilities provides high performance and flexibility for complex control algorithms and signal processing tasks.

- Integrated Peripherals: The device's rich set of peripherals simplify system design and reduce external component count, leading to cost-effective and compact solutions.

- Real-Time Responsiveness: The deterministic execution of tasks and fast interrupt response ensure timely control and monitoring of critical processes, enhancing system performance and reliability.

- Low Power Consumption: Despite its high computational power, the device features low-power modes and advanced power management techniques, extending battery life and reducing energy consumption in portable and battery-operated applications.

Efficiency Enhancement:

To further improve system performance and efficiency, designers can implement techniques such as hardware acceleration, algorithm optimization, and parallel processing using the device's DSP capabilities. Additionally, utilizing advanced peripherals and communication interfaces can streamline data exchange and reduce latency, enhancing overall system responsiveness.

By leveraging the DSPIC33EP512MC202-H/SP's advanced features and optimizing system design, developers can create innovative embedded control solutions with superior performance, reliability, and efficiency across various application domains.

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6. What is the process for return or replacement of DSPIC33EP512MC202-H/SP?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of DSPIC33EP512MC202-H/SP.

(3)The PartNo is unused and only in the original unpacked packaging.

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