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Name: DS110DF111SQE/NOPB
Brand: Texas Instruments
SKU: DS110DF111SQE/NOPB
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Texas Instruments DS110DF111SQE/NOPB

Part No.:: DS110DF111SQE/NOPB

Manufacturer:: Texas Instruments

Package:: 24-WFQFN Exposed Pad

Datasheet:: DS110DF111SQE/NOPB.pdf

Description:: IC INTERFACE SPECIALIZED 24WQFN

In Stock:: 2396

Quantity:: Add To Cart

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DS110DF111SQE/NOPB Specifications

Package/Case:
24-WFQFN Exposed Pad
Packaging:
Tape & Reel (TR),Cut Tape (CT),Digi-Reel®
Series:
-
ProductStatus:
Active
Applications:
-
Interface:
Serial
Voltage-Supply:
2.375V ~ 2.625V, 3V ~ 3.6V

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DS110DF111SQE/NOPB information

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DS110DF111SQE/NOPB Typical application Circuitry

DS110DF111SQE NOPB

The DS110DF111SQE/NOPB is a high-speed signal conditioning and retiming buffer from Texas Instruments, designed to manage and enhance the integrity of high-speed differential signals. This chip is particularly useful in applications requiring the extension of high-speed data transmission over long or challenging electrical paths, including backplane, cable, and PCB traces. It finds its applications in data centers, high-performance computing, telecommunications, and networking equipment, among others.

Key Features and Parameters:

- Dual-Channel Operation: Provides two channels of signal conditioning, supporting bidirectional operation.

- High-Speed Data Rates: Supports data rates up to 14.025 Gbps, making it suitable for a wide range of high-speed data protocols.

- Signal Conditioning Features: Includes features like adaptive equalization, output de-emphasis, and retiming, significantly improving signal quality over long distances.

- Low electricity Consumption: Made with the intention of using the least amount of electricity possible, especially when running on backup batteries.

- Flexible Configuration: Can be configured via pin strapping or an SMBus/I2C interface, offering versatility in usage.

Application Scenario – Extending High-Speed Data Transmission in a Data Center:

In a data center environment, the DS110DF111SQE/NOPB can be used to enhance the signal integrity of high-speed differential data links between servers and storage arrays, ensuring reliable data communication over extended distances or through dense backplanes.

Circuit Design Details:

1. Power Supply Connection:

- VCC (Pins 1, 10, 20, 30): Connect these pins to a stable +3.3V power source. It's imperative to use decoupling capacitors near these pins to filter out noise from the power supply.

2. High-Speed Differential Input:

- RIN± (Pins 2 and 3 for Channel 1, Pins 21 and 22 for Channel 2): Connect the differential input signals to these pins. Careful routing and impedance matching are critical to preserve signal integrity.

3. High-Speed Differential Output:

- ROUT± (Pins 5 and 6 for Channel 1, Pins 24 and 25 for Channel 2): The conditioned and retimed differential outputs are available at these pins. The outputs should be connected to the receiving device with controlled impedance traces.

4. Configuration and Control:

- SMBus/I2C Interface (SDA, SCL, Pins 16 and 17): Utilize these pins for dynamic configuration of the device via SMBus/I2C. This allows for in-system adjustments to equalization, de-emphasis, and other parameters.

- Pin Strapping (Various Pins): For static configuration, specific pins can be strapped to VCC or GND to set default operational modes, such as the level of equalization or the operational data rate.

5. Signal Integrity Enhancement:

- CTADJ (Pin 27): Connect a capacitor to this pin to adjust the cut-off frequency of the input equalizer, tailoring the device's response to the specific characteristics of the transmission medium.

Design Considerations:

- EMI and Crosstalk: Implement appropriate shielding and separation between high-speed lines to minimize electromagnetic interference and signal crosstalk.

- Thermal Management: Assess the thermal impact of the DS110DF111SQE/NOPB in operation, ensuring that any generated heat does not adversely affect the device or surrounding components.

- PCB Layout: Optimize the PCB layout for signal integrity, using differential pairs with matched lengths for the high-speed lines and placing decoupling capacitors close to the power supply pins.

- Power Supply Quality: Ensure that the power supply to the DS110DF111SQE/NOPB is clean and stable, utilizing filtering and stabilization techniques to avoid introducing jitter or distortion into the high-speed signals.

- Firmware and Software: If utilizing the SMBus/I2C interface for dynamic configuration, develop robust firmware routines for the controlling microcontroller to manage the DS110DF111SQE/NOPB settings effectively, allowing adjustments based on system performance feedback.

Incorporating the DS110DF111SQE/NOPB into a data center's high-speed data transmission path exemplifies its utility in enhancing signal quality over challenging transmission mediums. This scenario highlights the critical role of advanced signal conditioning solutions in supporting the reliability and efficiency of data communications in modern infrastructures, ensuring that data integrity is maintained across the system's physical layer.

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6. What is the process for return or replacement of DS110DF111SQE/NOPB?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

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