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Name: CSD95379Q3M
Brand: Texas Instruments
SKU: CSD95379Q3M
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Texas Instruments CSD95379Q3M

Part No.:: CSD95379Q3M

Manufacturer:: Texas Instruments

Package:: 10-PowerVFDFN

Datasheet:: CSD95379Q3M.pdf

Description:: IC SYNC BUCK NEXFET 10VSON

In Stock:: 2230

Quantity:: Add To Cart

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CSD95379Q3M Specifications

Packaging:
Tape & Reel (TR),Cut Tape (CT),Digi-Reel®
Series:
NexFET™
ProductStatus:
Active
OutputConfiguration:
Half Bridge
Applications:
Synchronous Buck Converters
Interface:
PWM
LoadType:
Inductive
Technology:
Power MOSFET
RdsOn(Typ):
-
Current-Output/Channel:
20A
Current-PeakOutput:
45A
Voltage-Supply:
4.5V ~ 5.5V
Voltage-Load:
4.5V ~ 16V
OperatingTemperature:
-40°C ~ 150°C (TJ)
Features:
Bootstrap Circuit, Diode Emulation
FaultProtection:
Shoot-Through, UVLO
MountingType:
Surface Mount

CSD95379Q3M this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including CSD95379Q3M price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for CSD95379Q3M to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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CSD95379Q3M information

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CSD95379Q3M Typical application Circuitry

The CSD95379Q3M is a synchronous buck NexFET power stage from Texas Instruments, designed for high-frequency operation in synchronous buck converters. This device integrates the driver, high-side MOSFET, and low-side MOSFET into a single package, which simplifies the design and reduces board space. Here's an overview of the application circuit:

1. Supply Voltage (PVIN): This pin is connected to the power supply voltage, which should match the voltage requirements of your specific application and within the device's specified operating voltage.
2. Switch Node (SW): The CSD95379Q3M SW pin is the switching node connection to the inductor. This node carries the high-frequency switching signal, and its layout should be carefully considered to minimize parasitic inductance and capacitance.
3. Ground (PGND): This is the power ground pin and should be connected to the system ground.
4. High-Side Gate Drive Output (BOOT): A connection is made between the BOOT pin and the high-side gate drive bootstrap supply. Connecting a capacitor between the BOOT and SW pins creates the bootstrap supply for the high-side gate driver.
5. Input Signal (PWM): The CSD95379Q3M PWM signal is applied at this pin to control the operation of the converter. The PWM signal typically comes from a controller or a regulator IC.
6. Bootstrap Capacitor (Cboot): Between the BOOT and SW pins is attached the CSD95379Q3M bootstrap capacitor. It offers the voltage required to activate the high-side MOSFET.
7. Output Inductor (L): The output inductor is connected to the SW pin and the output voltage node. The intended ripple current is taken into account while choosing the inductor value.
8. Output Capacitor (Cout): Between the output voltage node and ground, the CSD95379Q3M output capacitor is attached. It helps reduce the output voltage ripple.
9. Decoupling Capacitor (Cin): The decoupling capacitor is connected between the PVIN pin and ground. It helps reduce the noise and voltage spikes on the power supply line.
Always refer to the device's datasheet and application notes for the exact circuit configurations and components values.

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6. What is the process for return or replacement of CSD95379Q3M?

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of CSD95379Q3M.

(3)The PartNo is unused and only in the original unpacked packaging.

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