What is the Additional Feature ?

Name: BCM88790CB0KFSBG
Brand: Broadcom Limited
SKU: BCM88790CB0KFSBG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Broadcom Limited BCM88790CB0KFSBG

Part No.:: BCM88790CB0KFSBG

Manufacturer:: Broadcom Limited

Package:: -

Datasheet:: BCM88790CB0KFSBG.pdf

Description:: RAMON B0 196 X 50G SERDES SUPERS

In Stock:: 2386

Quantity:: Add To Cart

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BCM88790CB0KFSBG Specifications

Packaging:
Tray
Series:
-
ProductStatus:
Active
Type:
-
Circuit:
-
IndependentCircuits:
-
Current-OutputHighLow:
-
VoltageSupplySource:
-
Voltage-Supply:
-
OperatingTemperature:
-
MountingType:
-

BCM88790CB0KFSBG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including BCM88790CB0KFSBG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for BCM88790CB0KFSBG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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BCM88790CB0KFSBG information

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BCM88790CB0KFSBG Typical application Circuitry

The BCM88790CB0KFSBG is a cutting-edge network switch chip designed by Broadcom as part of its high-performance StrataXGS® product line. This chip is optimized for modern data center and enterprise network environments, providing extensive capabilities for handling massive amounts of data traffic with low latency and high efficiency.

Key Features and Specifications:

- High Capacity: Engineered to support multi-terabit throughput levels, suitable for high-demand network backbones.

- Advanced Packet Processing: Equipped with sophisticated packet processing capabilities, supporting detailed QoS, ACL, and routing functionalities.

- Energy Efficiency: Incorporates energy-efficient technologies to minimize power consumption without sacrificing performance.

- Scalability: Supports a scalable architecture that allows for the expansion of network capacity without significant hardware changes.

- High Port Density: Capable of managing multiple high-speed interfaces such as 10G, 40G, and 100G Ethernet ports.

Application Scenario: High-Density Network Switch

In this application, the BCM88790CB0KFSBG is used to develop a high-density network switch designed for a large-scale data center. This switch facilitates the routing and switching of data between servers and external networks at high speeds.

Circuit Design Methodology:

1. Power Supply Configuration:

- Core Voltage (Vcore): Apply a stable 1.0V supply for the core logic through high-quality LDOs (Low Drop-Out regulators) and switching regulators. Attach bypass capacitors (0.1µF, 1µF, and 10µF) close to the power pins to stabilize voltage and filter out noise.

- I/O Voltage (Vddio): Ensure a 3.3V supply for the input/output interfaces with appropriate regulation and noise suppression techniques.

2. Interface Design:

- Ethernet Port Layout: Implement numerous Ethernet ports for 10G, 40G, and 100G operations, using the chip's high-speed SerDes capabilities. Each port must be paired with matching PHY chips and magnetics where necessary, observing impedance matching and EMI reduction techniques.

- Optical Module Integration: For optical interfaces, include SFP, SFP+, and QSFP modules to enable fiber optic communication, ensuring layout optimization for minimal signal loss.

3. Signal Integrity and Routing:

- PCB Trace Design: Utilize controlled impedance PCB traces for all high-speed signals, implementing differential signaling where applicable to reduce crosstalk and enhance signal integrity.

- Clock Distribution: Use a precision clock source with low phase noise. Distribute the clock through a dedicated network of buffers to maintain signal integrity across the chip.

4. Thermal Management:

- Cooling Mechanisms: Design a comprehensive cooling system using heatsinks, thermal pads, and air-flow management to dissipate heat effectively from the BCM88790CB0KFSBG and maintain operational temperatures within safe limits.

5. Diagnostics and Testing:

- Test Interfaces: Incorporate interfaces such as JTAG for debugging and diagnostics to facilitate manufacturing tests and field diagnostics.

Design Considerations:

- Reliability: Ensure that the system is designed with redundancy for power supplies and key signal paths to enhance reliability and uptime.

- Scalability: Design interfaces and system architecture to be scalable, allowing for future expansion with minimal additional investment.

- Regulatory Compliance: Adhere to industry standards for safety, EMI, and environmental impact, ensuring that the switch meets global operational and sales requirements.

Using the BCM88790CB0KFSBG in a high-density network switch highlights its capabilities in handling massive data flows efficiently, making it ideal for next-generation data centers and advanced enterprise networking solutions. This example showcases the chip's robustness and versatility in a critical application that demands high performance and reliability.

BCM88790CB0KFSBG FAQ

1. How to order BCM88790CB0KFSBG on icwhale.com?

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3. Are the BCM88790CB0KFSBG price and inventory displayed accurate?

The price and inventory of BCM88790CB0KFSBG fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

4. What forms of payment are accepted?

Wire Transfer, PayPal, Alipay, Wechat, Credit Card, Western Union, MoneyGram, and Escrow are all acceptable.

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5. How is the shipping arranged?

Customers can choose industry-leading freight companies, including DHL, UPS, FedEx, TNT, and Registered Mail. Shipping insurance is also available.

Once your order has been processed for shipment, our salesperson will send you an email advising you of the shipping status and tracking number.

Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of BCM88790CB0KFSBG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the BCM88790CB0KFSBG we delivered, we will accept the replacement or return of the BCM88790CB0KFSBG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of BCM88790CB0KFSBG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations