BCM8724BIFBG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including BCM8724BIFBG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for BCM8724BIFBG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.
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Key Features and Specifications:
- Dual-Channel Operation: Enables two 10GbE connections simultaneously, offering high bandwidth capacity and redundancy.
- Support for SFP+ Modules: Compatible with Small Form-factor Pluggable Plus (SFP+) modules, facilitating fiber optic and direct attach copper connections.
- High-Speed Serial Connectivity: Utilizes XAUI (10 Gigabit Attachment Unit Interface) on the backplane for high-speed data transfer between the PHY and network processors or switches.
- Low Power Consumption: Designed with power efficiency in mind, suitable for environments where energy consumption is a concern.
- Advanced Signal Processing: Features robust signal integrity tools for optimal performance over varied transmission mediums.
Application Scenario: Data Center Switch
In this scenario, the BCM8724BIFBG is utilized within a data center switch platform, providing high-density, high-speed 10GbE connectivity to support server aggregations and storage networking.
Circuit Design Methodology:
1. Power Supply Design:
- Core Voltage (Vdd): Supply a stable 1.2V power source to the core of the BCM8724BIFBG. Implement stringent power regulation using LDOs and place multiple decoupling capacitors (0.1µF, 1µF) near the power pins to ensure clean and stable operation.
- IO Voltage (Vddtx and Vddrx): Provide 3.3V to the transmitter and receiver circuits. Ensure that these supplies are also well-regulated and decoupled.
2. Interface Connections:
- Optical Interface (SFP+ Ports): Design the PCB to accommodate SFP+ modules for fiber connectivity. Include impedance-controlled traces and ESD protection circuits to protect against static damage.
- Copper Interface: If supporting copper modules, ensure that the layout includes provisions for heat dissipation and electromagnetic interference (EMI) shielding.
3. High-Speed Serial Data Paths:
- XAUI Interface: Route the XAUI lanes with controlled impedance, maintaining tight differential pair spacing and length matching to minimize skew and signal degradation.
- Clock Distribution: Provide a stable clock source for the XAUI interface using a low-jitter clock generator, essential for maintaining data integrity at high speeds.
4. Thermal Management:
- Heat Dissipation: As the BCM8724BIFBG can generate significant heat under full load, design the switch with adequate cooling strategies, including airflow management and heat sinks if necessary.
5. Diagnostics and Management:
- MDIO Interface: Implement a Management Data Input/Output interface to configure and monitor the status of the BCM8724BIFBG. This interface allows for real-time diagnostics and adjustments to optimize performance.
Design Considerations:
- PCB Layout: Carefully plan the PCB layout to optimize signal integrity for high-speed lanes. Use a multi-layer board to separate power and ground planes from signal layers.
- Signal Integrity: Apply best practices for high-speed circuit design, including the use of termination resistors and avoiding acute angles in trace routing to reduce reflection and crosstalk.
- Power Integrity: Design the power distribution network to handle transient responses without affecting the stability of the BCM8724BIFBG.
- EMI Considerations: Incorporate shielding techniques and keep high-speed traces away from sensitive analog areas to minimize EMI.
- Reliability Testing: Ensure the design undergoes rigorous testing for thermal, mechanical, and operational stability, especially considering the demanding environment of a data center.
Using the BCM8724BIFBG in a data center switch scenario highlights its ability to facilitate robust and efficient high-speed networking, making it an integral component in modern IT infrastructure. This application demonstrates the BCM8724BIFBG's effectiveness in managing dense, high-throughput network environments.
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All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the BCM8724BIFBG we delivered, we will accept the replacement or return of the BCM8724BIFBG only when all of the below conditions are fulfilled:
(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.
(2)We are informed of the defect described above within 90 days after the delivery of BCM8724BIFBG.
(3)The PartNo is unused and only in the original unpacked packaging.
Two processes to return the products:
(1)Inform us within 90 days
(2)Obtain Requesting Return Authorizations
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