What is the Additional Feature ?

Name: BCM84728AIFSBG
Brand: Broadcom Limited
SKU: BCM84728AIFSBG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

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Broadcom Limited BCM84728AIFSBG

Part No.:: BCM84728AIFSBG

Manufacturer:: Broadcom Limited

Package:: -

Datasheet:

Description:: DUAL-CHANNEL 10GBE SFI-TO-XAUI L

In Stock:: 3181

Quantity:: Add To Cart

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BCM84728AIFSBG Specifications

Package/Case:
-
Packaging:
Tray
Series:
*
ProductStatus:
Obsolete
Type:
-
Protocol:
-
NumberofDrivers/Receivers:
-
Duplex:
-
ReceiverHysteresis:
-
DataRate:
-
Voltage-Supply:
-
OperatingTemperature:
-
MountingType:
-

BCM84728AIFSBG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including BCM84728AIFSBG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for BCM84728AIFSBG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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BCM84728AIFSBG information

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BCM84728AIFSBG Typical application Circuitry

The BCM84728AIFSBG is a multi-rate physical layer transceiver (PHY) designed by Broadcom, intended for use in high-speed network interfaces such as those found in data centers and enterprise-level network infrastructure. This chip supports 10 Gigabit Ethernet over copper and fiber, making it versatile for different media types.

Key Features and Specifications:

- Multi-Rate Support: Capable of handling data rates from 1 Gigabit to 10 Gigabits, accommodating a variety of network speeds.

- Dual Media Support: Operates across both copper (10GBASE-T) and optical fiber interfaces (10GBASE-SR, 10GBASE-LR), providing flexibility in connection types.

- Energy Efficient: Features low power consumption relative to other high-speed PHY devices, aligning with green IT initiatives.

- Advanced Signal Processing: Includes sophisticated algorithms for signal equalization and correction, ensuring reliable data transmission over longer distances and through challenging media.

- Integrated Electronic Dispersion Compensation (EDC): Built-in EDC for managing signal integrity over long-distance fiber links.

Application Scenario: Data Center Network Interface Card (NIC)

In this scenario, the BCM84728AIFSBG is utilized within a high-performance network interface card designed for server connectivity in a data center, providing high-speed network access through both copper and optical fiber connections.

Circuit Design Methodology:

1. Power Supply Connections (VDD, GND):

- Core Power (VDD): Supply a stable 1.2V power source for digital operations and 3.3V for analog components using high-precision regulators. Include a series of decoupling capacitors (0.1 µF, 1 µF) near the power pins to filter out power supply noise.

- Ground (GND): Ensure that a solid ground plane is used for both the digital and analog sections to minimize noise and interference.

2. Ethernet Interface (TX, RX, RJ-45, SFP+ Modules):

- Copper Interface: Design circuits to connect the TX and RX lines to RJ-45 connectors through appropriate transformers and filters to handle 10GBASE-T signals.

- Optical Interface: For fiber connections, route TX and RX to SFP+ modules, ensuring that the signal paths are optimized for high-frequency operation to support 10GBASE-SR/LR.

3. Clock Management (Reference Clock Input):

- Clock Inputs: Provide a stable reference clock, essential for maintaining synchronization of the data streams. Use a low-jitter clock source that meets the stringent requirements of 10 Gigabit Ethernet.

4. Control and Status Interface (MDIO):

- Management Data Input/Output (MDIO): Implement MDIO interface for configuration and management of the PHY settings, allowing real-time adjustments and diagnostics from the system's host processor.

5. Thermal Management:

- Heat Dissipation: Consider the implementation of adequate heat sinks or airflow management solutions, particularly if the NIC is to be used in high-density configurations typical of modern data centers.

Design Considerations:

- PCB Layout: Prioritize a layout that minimizes the routing distances for high-speed signals, using differential signaling where possible to enhance noise immunity.

- Signal Integrity: Use impedance-controlled PCB traces and maintain adequate spacing between high-speed lines to avoid crosstalk and ensure clean signal transmission.

- Power Integrity: Develop a power distribution network capable of delivering stable and clean power to all parts of the circuit, especially under variable load conditions.

- EMI and EMC Compliance: Ensure that the NIC design complies with industry standards for electromagnetic compatibility, which is critical in a high-density server environment.

- Component Placement: Strategically place components to minimize path lengths for critical signals and to facilitate easier routing and better thermal management.

Utilizing the BCM84728AIFSBG within a Network Interface Card allows data centers to efficiently manage high-speed data transfers over diverse media types, ensuring robust connectivity and high throughput in demanding network environments. This application effectively showcases the capability of the BCM84728AIFSBG to serve as a critical component in advanced communication hardware.

BCM84728AIFSBG FAQ

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3. Are the BCM84728AIFSBG price and inventory displayed accurate?

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6. What is the process for return or replacement of BCM84728AIFSBG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the BCM84728AIFSBG we delivered, we will accept the replacement or return of the BCM84728AIFSBG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of BCM84728AIFSBG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations