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Name: BCM53162XMB1ILFBG
Brand: Broadcom Limited
SKU: BCM53162XMB1ILFBG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Broadcom Limited BCM53162XMB1ILFBG

Part No.:: BCM53162XMB1ILFBG

Manufacturer:: Broadcom Limited

Package:: 425-LFBGA

Datasheet:

Description:: IC ETHERNET SWITCH GPIO 425LFBGA

In Stock:: 553

Quantity:: Add To Cart

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BCM53162XMB1ILFBG this integrated circuit is available in factory sealed anti static packs. at icwhale.com. Please read product page below detail information. including BCM53162XMB1ILFBG price, data-sheet, in-stock availability, technical difficulties. Also. Quickly Enter the access of compare listing to find out replaceable electronic parts. If you want to retrieve comprehensive data for BCM53162XMB1ILFBG to optimize the supply chain (including cross references, life-cycle, parametric, counterfeit risk, obsolescence managements forecasts), please contact to our Tech-supports team.

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BCM53162XMB1ILFBG Typical application Circuitry

The BCM53162XMB1ILFBG is a sophisticated multi-gigabit Ethernet switch chip designed by Broadcom, tailored for deployment in high-performance networking applications requiring robust data transfer capabilities. This chipset is particularly suitable for scenarios like enterprise networking solutions, data centers, and advanced smart networking devices, where efficient data handling and high-speed connectivity are paramount.

Key Features and Specifications:

- High-Speed Ethernet Support: Provides support for multi-gigabit Ethernet speeds, enhancing data transmission capabilities across networks.

- Port Configuration: Equipped with multiple Ethernet ports, each capable of handling 1G, 2.5G, 5G, and 10G speeds, offering flexibility and scalability in network design.

- Advanced Security Features: Includes sophisticated security protocols to ensure secure data transmissions and protect against network threats.

- Energy Efficiency: Features energy-efficient Ethernet technology, which helps reduce power consumption based on dynamic traffic conditions.

- Quality of Service (QoS): Supports comprehensive QoS features, prioritizing network traffic to enhance the performance of critical applications.

Application Scenario: Enterprise Network Switch

In this scenario, the BCM53162XMB1ILFBG is used to design a high-capacity enterprise network switch, capable of managing extensive network traffic and providing robust connectivity for numerous devices.

Circuit Design Methodology:

1. Power Supply Connections (VDD, GND):

- VDD: Connect the VDD pins to a stable 3.3V power supply. Employ precision voltage regulators to ensure the supply remains stable under variable load conditions. Include bypass capacitors (e.g., 100 µF and 0.1 µF) close to the power pins to filter out any voltage spikes and stabilize the power supply.

- GND: Connect all ground pins to a common ground plane to minimize noise and ensure stable operation of the device.

2. Ethernet Interface (RX, TX, SFP Modules):

- RX/TX Pins: Connect these to appropriate magnetics modules and then to the respective RJ-45 or SFP+ ports for interfacing with network cables. Ensure that signal integrity is maintained by using impedance-matched traces and minimizing the route length to reduce signal degradation.

- SFP Modules: For high-speed connections, connect SFP+ modules to the designated ports to support fiber optic connections or enhanced Ethernet speeds.

3. Configuration and Management (MDIO, MDC):

- MDIO (Management Data Input/Output) and MDC (Management Data Clock): These pins should be interfaced with a network management microcontroller for configuration and management of the switch settings. Utilize these connections for dynamic configuration and firmware updates.

4. LED Status Indicators (LED Outputs):

- LED Outputs: Connect LED indicators to these pins to provide visual feedback for port status (link, activity, speed), helping in quick diagnostics and monitoring of network status.

5. Thermal Management and Layout Considerations:

- Cooling Requirements: Given the potential high-power operation, incorporate adequate cooling strategies such as heatsinks or airflow management systems, especially in densely packed rack-mount scenarios.

- PCB Layout: Ensure the PCB layout minimizes crosstalk and electromagnetic interference, particularly between high-speed signal traces and power lines. Use ground planes effectively to shield sensitive components.

Design Considerations:

- Signal Integrity: Carefully plan the layout to preserve signal integrity for high-speed data transmission. This includes controlled impedance PCB traces and adequate spacing between different signal layers.

- Power Integrity: Implement a robust power distribution network to handle the demands of multiple high-speed ports, ensuring minimal voltage drop across the circuit.

- Reliability and Testing: Design for reliability by incorporating redundancy where feasible and conducting extensive testing to ensure the switch operates reliably under different network loads and conditions.

- Security Measures: Leverage the advanced security features of the BCM53162XMB1ILFBG to implement network security at the hardware level, enhancing overall network integrity.

- Regulatory Compliance: Ensure the design meets all relevant EMC and safety standards required for enterprise networking equipment, facilitating smooth certification and deployment.

By employing the BCM53162XMB1ILFBG in an enterprise network switch, network engineers can effectively handle massive data flows while ensuring reliable, secure, and efficient connectivity across the network infrastructure. This setup demonstrates the chip's advanced capabilities in supporting modern network demands.

BCM53162XMB1ILFBG information

BCM53162XMB1ILFBG Specifications

Package/Case:
425-LFBGA
Packaging:
Tray
Series:
RoboSwitch™
ProductStatus:
Active
Protocol:
Ethernet
Function:
Switch
Interface:
GPIO, I²C, MII, SPI
Standards:
IEEE 802.3, 10/100/1000 Base-T/TX PHY
Voltage-Supply:
-
Current-Supply:
-
OperatingTemperature:
-40°C ~ 85°C

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3. Are the BCM53162XMB1ILFBG price and inventory displayed accurate?

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6. What is the process for return or replacement of BCM53162XMB1ILFBG?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the BCM53162XMB1ILFBG we delivered, we will accept the replacement or return of the BCM53162XMB1ILFBG only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of BCM53162XMB1ILFBG.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations