Datasheet Photo Mfr. Part # Stock Price Quantity Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
126-91-424-41-003000

Datasheet

126-91-424-41-003000

126-91-424-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2280 15.53
- +

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Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-624-41-003000

Datasheet

126-91-624-41-003000

126-91-624-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2184 15.53
- +

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Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-320-41-001000

Datasheet

612-93-320-41-001000

612-93-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

2081 15.53
- +

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Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-420-41-001000

Datasheet

612-93-420-41-001000

612-93-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

3852 15.53
- +

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Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-320-41-001000

Datasheet

612-43-320-41-001000

612-43-320-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3018 15.53
- +

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Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-420-41-001000

Datasheet

612-43-420-41-001000

612-43-420-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3532 15.53
- +

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Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-6503-21

Datasheet

16-6503-21

16-6503-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2607 15.53
- +

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Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-6503-31

Datasheet

16-6503-31

16-6503-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2440 15.53
- +

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Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-0503-21

Datasheet

18-0503-21

18-0503-21

CONN SOCKET SIP 18POS GOLD

Aries Electronics

2379 15.53
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Bulk 0503 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
18-0503-31

Datasheet

18-0503-31

18-0503-31

CONN SOCKET SIP 18POS GOLD

Aries Electronics

2573 15.53
- +

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Bulk 0503 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
612-41-328-41-004000

Datasheet

612-41-328-41-004000

612-41-328-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3728 15.53
- +

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Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-428-41-004000

Datasheet

612-41-428-41-004000

612-41-428-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2923 15.53
- +

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Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-628-41-004000

Datasheet

612-41-628-41-004000

612-41-628-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3432 15.53
- +

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Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-328-41-004000

Datasheet

612-91-328-41-004000

612-91-328-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2388 15.53
- +

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Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-428-41-004000

Datasheet

612-91-428-41-004000

612-91-428-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3646 15.53
- +

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Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-628-41-004000

Datasheet

612-91-628-41-004000

612-91-628-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3065 15.53
- +

Add To Cart

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Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
326-93-120-41-001000

Datasheet

326-93-120-41-001000

326-93-120-41-001000

SOCKET WRAP SOLDERTAIL SIP 20POS

Mill-Max Manufacturing Corp.

2388 15.54
- +

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Tube 326 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-320-41-001000

Datasheet

126-93-320-41-001000

126-93-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

2743 15.54
- +

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Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-636-31-007000

Datasheet

614-41-636-31-007000

614-41-636-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2552 15.55
- +

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Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-636-31-007000

Datasheet

614-91-636-31-007000

614-91-636-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2530 15.55
- +

Add To Cart

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Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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