Datasheet Photo Mfr. Part # Stock Price Quantity Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
612-91-422-41-003000

Datasheet

612-91-422-41-003000

612-91-422-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2284 15.49
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Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-328-41-007000

Datasheet

116-41-328-41-007000

116-41-328-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3959 15.49
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Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-320-41-004000

Datasheet

612-41-320-41-004000

612-41-320-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2944 15.52
- +

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Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-420-41-004000

Datasheet

612-41-420-41-004000

612-41-420-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2841 15.52
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Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-320-41-004000

Datasheet

612-91-320-41-004000

612-91-320-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3375 15.52
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Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-420-41-004000

Datasheet

612-91-420-41-004000

612-91-420-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2351 15.52
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Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-420-41-001000

Datasheet

126-93-420-41-001000

126-93-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

3629 15.54
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Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-320-41-001000

Datasheet

126-43-320-41-001000

126-43-320-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3092 15.54
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Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-420-41-001000

Datasheet

126-43-420-41-001000

126-43-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2572 15.54
- +

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Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-648-41-105000

Datasheet

110-47-648-41-105000

110-47-648-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

3586 15.54
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Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-41-640-41-012000

Datasheet

146-41-640-41-012000

146-41-640-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

2212 15.31
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Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-91-640-41-012000

Datasheet

146-91-640-41-012000

146-91-640-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

2301 15.31
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Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-318-41-780000

Datasheet

104-13-318-41-780000

104-13-318-41-780000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

2870 15.31
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Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
30-820-90C

Datasheet

30-820-90C

30-820-90C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3448 15.31
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Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-822-90C

Datasheet

30-822-90C

30-822-90C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2629 15.31
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Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-823-90C

Datasheet

30-823-90C

30-823-90C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2801 15.31
- +

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Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
114-41-950-41-117000

Datasheet

114-41-950-41-117000

114-41-950-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2118 15.31
- +

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Tube 114 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-91-950-41-117000

Datasheet

114-91-950-41-117000

114-91-950-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2187 15.31
- +

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Tube 114 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-068-11-061001 510-91-068-11-061001

510-91-068-11-061001

SOCKET SOLDERTAIL 68-PGA

Mill-Max Manufacturing Corp.

2582 15.31
- +

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Tube 510 Active PGA 68 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-13-318-41-001000

Datasheet

123-13-318-41-001000

123-13-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

2349 15.31
- +

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Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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