Datasheet Photo Mfr. Part # Stock Price Quantity Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
19-71080-10

Datasheet

19-71080-10

19-71080-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

2358 15.00
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Bulk 700 Elevator Strip-Line™ Active SIP 19 (1 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
19-7375-10

Datasheet

19-7375-10

19-7375-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

3476 15.00
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Bulk 700 Elevator Strip-Line™ Active SIP 19 (1 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
19-7400-10

Datasheet

19-7400-10

19-7400-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

2303 15.00
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Bulk 700 Elevator Strip-Line™ Active SIP 19 (1 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
19-7650-10

Datasheet

19-7650-10

19-7650-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

3090 15.00
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Bulk 700 Elevator Strip-Line™ Active SIP 19 (1 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
19-7750-10

Datasheet

19-7750-10

19-7750-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

2541 15.00
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Bulk 700 Elevator Strip-Line™ Active SIP 19 (1 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-81000-310C

Datasheet

20-81000-310C

20-81000-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3434 15.00
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Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-81156-310C

Datasheet

20-81156-310C

20-81156-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3548 15.00
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Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-81200-310C

Datasheet

20-81200-310C

20-81200-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3438 15.00
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Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-81250-310C

Datasheet

20-81250-310C

20-81250-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2545 15.00
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Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8190-310C

Datasheet

20-8190-310C

20-8190-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2410 15.00
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Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8240-310C

Datasheet

20-8240-310C

20-8240-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2414 15.00
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Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8260-310C

Datasheet

20-8260-310C

20-8260-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2843 15.00
- +

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Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8280-310C

Datasheet

20-8280-310C

20-8280-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2970 15.00
- +

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Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8300-310C

Datasheet

20-8300-310C

20-8300-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2323 15.00
- +

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Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8310-310C

Datasheet

20-8310-310C

20-8310-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2705 15.00
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Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8312-310C

Datasheet

20-8312-310C

20-8312-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2556 15.00
- +

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Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8323-310C

Datasheet

20-8323-310C

20-8323-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2663 15.00
- +

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Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8325-310C

Datasheet

20-8325-310C

20-8325-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3647 15.00
- +

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Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8330-310C

Datasheet

20-8330-310C

20-8330-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2249 15.00
- +

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Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8350-310C

Datasheet

20-8350-310C

20-8350-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2302 15.00
- +

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Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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