Datasheet Photo Mfr. Part # Stock Price Quantity Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
114-47-640-41-117000

Datasheet

114-47-640-41-117000

114-47-640-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

2531 14.13
- +

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Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
31-0508-20

Datasheet

31-0508-20

31-0508-20

CONN SOCKET SIP 31POS GOLD

Aries Electronics

3125 14.13
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Bulk 508 Active SIP 31 (1 x 31) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
31-0508-30

Datasheet

31-0508-30

31-0508-30

CONN SOCKET SIP 31POS GOLD

Aries Electronics

2035 14.13
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Bulk 508 Active SIP 31 (1 x 31) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
146-41-628-41-012000

Datasheet

146-41-628-41-012000

146-41-628-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

2796 14.14
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Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-91-628-41-012000

Datasheet

146-91-628-41-012000

146-91-628-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

3878 14.14
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Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-324-18-000101

Datasheet

510-83-324-18-000101

510-83-324-18-000101

CONN SOCKET PGA 324POS GOLD

Preci-Dip

3002 13.50
- +

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Bulk 510 Active PGA 324 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
10-0511-11

Datasheet

10-0511-11

10-0511-11

CONN SOCKET SIP 10POS GOLD

Aries Electronics

3376 14.14
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Tube 511 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
110-11-328-41-001000

Datasheet

110-11-328-41-001000

110-11-328-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3234 14.16
- +

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Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-11-428-41-001000

Datasheet

110-11-428-41-001000

110-11-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2553 14.16
- +

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Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-11-628-41-001000

Datasheet

110-11-628-41-001000

110-11-628-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3062 14.16
- +

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Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-318-41-006000

Datasheet

116-93-318-41-006000

116-93-318-41-006000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

3652 14.16
- +

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Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-318-41-006000

Datasheet

116-43-318-41-006000

116-43-318-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3073 14.16
- +

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Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-652-41-001000

Datasheet

110-91-652-41-001000

110-91-652-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

2411 14.17
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Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-652-41-001000

Datasheet

110-41-652-41-001000

110-41-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2834 14.17
- +

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Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
410-93-224-10-001000

Datasheet

410-93-224-10-001000

410-93-224-10-001000

SOCKET DUAL IN-LINE SLDRTL 24POS

Mill-Max Manufacturing Corp.

2936 14.17
- +

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Tube 410 Active Zig-Zag, Left Stackable 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
410-93-224-10-002000

Datasheet

410-93-224-10-002000

410-93-224-10-002000

SOCKET DUAL IN-LINE SLDRTL 24POS

Mill-Max Manufacturing Corp.

2180 14.17
- +

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Tube 410 Active Zig-Zag, Right Stackable 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-11-314-41-001000

Datasheet

121-11-314-41-001000

121-11-314-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2090 14.17
- +

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Tube 121 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
410-93-214-10-002000

Datasheet

410-93-214-10-002000

410-93-214-10-002000

SOCKET DUAL IN-LINE SLDRTL 14POS

Mill-Max Manufacturing Corp.

3912 14.17
- +

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Tube 410 Active Zig-Zag, Right Stackable 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-7490-10 20-7490-10

20-7490-10

SERIES 700 ELEV STRIP LINE

Aries Electronics

3291 14.18
- +

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- 700 Elevator Strip-Line™ Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-0501-21

Datasheet

15-0501-21

15-0501-21

CONN SOCKET SIP 15POS GOLD

Aries Electronics

2718 14.18
- +

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Bulk 501 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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