Datasheet Photo Mfr. Part # Stock Price Quantity Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
D01-9973242

Datasheet

D01-9973242

D01-9973242

CONN SOCKET SIP 32POS GOLD

Harwin Inc.

14048 3.49
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Tube D01-997 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D01-9953242

Datasheet

D01-9953242

D01-9953242

CONN SOCKET SIP 32POS GOLD

Harwin Inc.

3183 7.45
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Bulk D01-995 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D01-9972042

Datasheet

D01-9972042

D01-9972042

CONN SOCKET SIP 20POS GOLD

Harwin Inc.

5816 1.83
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Tube D01-997 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D2899-42

Datasheet

D2899-42

D2899-42

CONN IC DIP SOCKET 3POS GOLD

Harwin Inc.

1566 1.88
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Bulk D2 Active DIP, 0.3 (7.62mm) Row Spacing 3 (1 x 3), 2 Loaded 0.200 (5.08mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.200 (5.08mm) Tin 196.9µin (5.00µm) Brass Polyamide (PA), Nylon, Glass Filled
D2840-42

Datasheet

D2840-42

D2840-42

CONN IC DIP SOCKET 40POS GOLD

Harwin Inc.

255 4.60
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Tube D2 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic
D01-9952042

Datasheet

D01-9952042

D01-9952042

CONN SOCKET SIP 20POS GOLD

Harwin Inc.

364 5.74
- +

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Bulk D01-995 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
D2822-42

Datasheet

D2822-42

D2822-42

CONN IC DIP SOCKET 22POS GOLD

Harwin Inc.

1083 2.64
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Tube D2 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic
D2824-42

Datasheet

D2824-42

D2824-42

CONN IC DIP SOCKET 24POS GOLD

Harwin Inc.

2780 2.66
- +

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Tube D2 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic
D2928-42

Datasheet

D2928-42

D2928-42

CONN IC DIP SOCKET 28POS GOLD

Harwin Inc.

165 3.11
- +

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Tube D2 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic
D2832-42

Datasheet

D2832-42

D2832-42

CONN IC DIP SOCKET 32POS GOLD

Harwin Inc.

405 3.55
- +

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Tube D2 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic
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